Lucile Arnaud

13 papers B 1Journal 3Unranked 9
YearRankTypeTitle / Venue / Authors
2022 — conf
Apocalypse Dog.
SIGGRAPH Asia Computer Animation Festival
Aziliz Le Clainche, Camille Nasarre, Jing Qian, Juliette Barraux, Emma Plumey, Lucile Arnaud, Solène Cauchie, Philippe Meis
2021 — conf
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.
3DIC
Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier
2021 J jnl
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.
IEEE J. Solid State Circuits
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
2020 — conf
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm
ISSCC
Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
2019 — conf
Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects.
3DIC
Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné
2018 B conf
BISTs for post-bond test and electrical analysis of high density 3D interconnect defects.
ETS
Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné
2018 — conf
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.
IRPS
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, Frank Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
2016 — conf
ITAC: A complete 3D integration test platform.
3DIC
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
2016 — conf
Towards high density 3D interconnections.
3DIC
Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
2016 — conf
Towards high density 3D interconnections.
3DIC
Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet
2015 — conf
Interconnect design study for electromigration reliability improvement.
IRPS
Giulio Marti, Lucile Arnaud, David Ney, Yves Wouters
2014 J jnl
Study of EM void nucleation and mechanic relaxation effects.
Microelectron. Reliab.
Giulio Marti, Lucile Arnaud, Yves Wouters
2013 J jnl
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.
Microelectron. Reliab.
Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon