| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
IEEE Trans. Affect. Comput.
|
| 2025 | J | jnl |
Future Gener. Comput. Syst.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | C | conf |
iSPEC
|
| 2023 | — | conf |
PACIS
|
| 2023 | C | conf |
iSPEC
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | C | conf |
The effect of Atmospheric Pressure and Temperature on corona discharge process at lightning rod tip.
iSPEC
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | C | conf |
IECON
|
| 2016 | J | jnl |
Soft Comput.
|
| 2010 | — | conf |
CGGA
|