| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Syst. Man Cybern. Syst.
|
| 2025 | C | conf |
ISNN
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2023 | — | conf |
ChineseCSCW (2)
|
| 2023 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2022 | — | conf |
CACRE
|
| 2022 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2021 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Trans. Haptics
|
| 2019 | J | jnl |
Virtual Real. Intell. Hardw.
|
| 2018 | J | jnl |
J. Sensors
|