Liqiang Cao

20 papers C 2Journal 16Unranked 2
YearRankTypeTitle / Venue / Authors
2026 J jnl
Physical feature-based machine learning of BEOL thermal conductivity in 3D ICs.
Microelectron. J.
Yunting Liu, Rong Fu, Jixiang Zhu, Kun Zhang, Chuan Chen, Jun Li, Liqiang Cao
2025 J jnl
PDN analysis of 3D chiplet integration with a DC-DC converter on active interposer.
IEICE Electron. Express
Chengyi Liao, Huimin He, Fengze Hou, Cheng Peng, Fengman Liu, Liqiang Cao
2023 J jnl
Long-distance and anti-disturbance wireless power transfer based on concentric three-coil resonator and inhomogeneous electromagnetic metamaterials.
Int. J. Circuit Theory Appl.
Huilin An, Jian Yuan, Jun Li, Liqiang Cao
2022 J jnl
Antenna in package design and measurement for millimeter-wave applications in fan-out wafer-level package.
IEICE Electron. Express
Ying Chen, Jun Li, Fei Ding, Liqiang Cao
2022 J jnl
HY-DBSCAN: A hybrid parallel DBSCAN clustering algorithm scalable on distributed-memory computers.
J. Parallel Distributed Comput.
Guoqing Wu, Liqiang Cao, Hongyun Tian, Wei Wang
2022 J jnl
Research on Ni
IEICE Electron. Express
Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao
2021 J jnl
An optimization method for conformal shielding.
IEICE Electron. Express
Jian Yuan, Jun Li, Jia Cao, Pengwei Chen, Liqiang Cao, Tianchun Ye
2021 J jnl
Design of a Ka-band receiver front end using Si-based system in package.
IEICE Electron. Express
Hanxiang Zhu, Jun Li, Qidong Wang, Liqiang Cao
2021 J jnl
Si-based Ka-band SIW band-pass filter using wafer level manufacturing process.
IEICE Electron. Express
Hanxiang Zhu, Jun Li, Liqiang Cao, Jia Cao, Pengwei Chen
2021 J jnl
Si-based system-in-package design with broadband interconnection for E-band applications.
IEICE Electron. Express
Jiao Chu, Jun Li, Yunyan Zhou, Jia Cao, Pengwei Chen, Liqiang Cao
2019 — conf
A Performance Analysis of Large Scale Scientific Computing Applications from Log Archives.
IPDPS Workshops
Liqiang Cao, Xu Liu, Xiaowen Xu, Zhanjun Liu
2018 J jnl
Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process.
Microelectron. Reliab.
Meiying Su, Liqiang Cao, Tingyu Lin, Feng Chen, Jun Li, Cheng Chen, Gengxin Tian
2017 J jnl
Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling.
Microelectron. Reliab.
Delong Qiu, Liqiang Cao, Qidong Wang, Fengze Hou, XuGang Wang
2017 J jnl
Study on Magnetic Probe Calibration in Near-field Measurement System for EMI Application.
J. Electron. Test.
Gengxin Tian, Jun Li, Xiaofang Liu, Lixi Wan, Liqiang Cao
2017 J jnl
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.
Microelectron. Reliab.
Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan
2016 J jnl
Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros.
Microelectron. J.
Jie Pan, Huijuan Wang, Gengxin Tian, Liqiang Cao, Daquan Yu
2016 J jnl
Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.
Microelectron. Reliab.
Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan
2008 C conf
Jetter: a multi-pattern parallel I/O benchmark.
CLUSTER
Liqiang Cao, Hongbing Luo, Baoyin Zhang
2006 C conf
A Framework for Data Management and Transfer in Grid Environments.
EUC
Haojie Zhou, Xingwu Liu, Liqiang Cao, Li Zha
2004 — conf
Design and Implementation of Grid File Management System Hotfile.
GCC
Liqiang Cao, Jie Qiu, Li Zha, Haiyan Yu, Wei Li, Yuzhong Sun