Lingjun Zhu

41 papers A* 9A 8B 1Misc 1Journal 17Unranked 5
YearRankTypeTitle / Venue / Authors
2026 A conf
SmartNS: Enabling Line-rate and Flexible Network Stack with SmartNIC.
EuroSys
Xuzheng Chen, Jie Zhang, Baolin Zhu, Xueying Zhu, Zhongqing Chen, Ting Fu, Shu Ma, Lingjun Zhu, Chao Shi, Yin Zhang, Yuanchao Shu, Peng Cheng, Zeke Wang
2025 A* conf
Alibaba Stellar: A New Generation RDMA Network for Cloud AI.
SIGCOMM
Jie Lu, Jiaqi Gao, Fei Feng, Zhiqiang He, Menglei Zheng, Kun Liu, Jun He, Binbin Liao, Suwei Xu, Ke Sun, Yongjia Mo, Qinghua Peng, Jilie Luo, Qingxu Li, Gang Lu, Zishu Wang, Jianbo Dong, Kunling He, Sheng Cheng, Jiamin Cao, Hairong Jiao, Pengcheng Zhang, Shu Ma, Lingjun Zhu, Chao Shi, Yangming Zhang, Yiquan Chen, Wei Wang, Shuhong Zhu, Xingru Li, Qiang Wang, Jiang Liu, Chao Wang, Wei Lin, Ennan Zhai, Jiesheng Wu, Qiang Liu, Binzhang Fu, Dennis Cai
2025 J jnl
Evolving the Cloud Block Store with Performance, Elasticity, Availability, and Hardware Offloading.
ACM Trans. Storage
Erci Xu, Weidong Zhang, Qiuping Wang, Xiaolu Zhang, Yuesheng Gu, Zhenwei Lu, Tao Ouyang, Guanqun Dong, Wenwen Peng, Zhe Xu, Shuo Zhang, Dong Wu, Yilei Peng, Tianyun Wang, Haoran Zhang, Jiasheng Wang, Wenyuan Yan, Yuanyuan Dong, Wenhui Yao, Zhongjie Wu, Lingjun Zhu, Chao Shi, Yinhu Wang, Rong Liu, Junping Wu, Jiaji Zhu, Jiesheng Wu
2025 J jnl
FlexiNS: A SmartNIC-Centric, Line-Rate and Flexible Network Stack.
CoRR
Xuzheng Chen, Jie Zhang, Baolin Zhu, Xueying Zhu, Zhongqing Chen, Shu Ma, Lingjun Zhu, Chao Shi, Yin Zhang, Zeke Wang
2025 J jnl
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Pruek Vanna-Iampikul, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan, Sung Kyu Lim
2025 A conf
Hey Hey, My My, Skewness Is Here to Stay: Challenges and Opportunities in Cloud Block Store Traffic.
EuroSys
Haonan Wu, Erci Xu, Ligang Wang, Yuandong Hong, Changsheng Niu, Bo Shi, Lingjun Zhu, Jinnian He, Dong Wu, Weidong Zhang, Qiuping Wang, Changhong Wang, Xinqi Chen, Guangtao Xue, Yi-Chao Chen, Dian Ding
2024 J jnl
A PPA Study for Heterogeneous 3-D IC Options: Monolithic, Hybrid Bonding, and Microbumping.
IEEE Trans. Very Large Scale Integr. Syst.
Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim
2024 B conf
Demystifying Datapath Accelerator Enhanced Off-path SmartNIC.
ICNP
Xuzheng Chen, Jie Zhang, Ting Fu, Yifan Shen, Shu Ma, Kun Qian, Lingjun Zhu, Chao Shi, Yin Zhang, Ming Liu, Zeke Wang
2024 J jnl
Demystifying Datapath Accelerator Enhanced Off-path SmartNIC.
CoRR
Xuzheng Chen, Jie Zhang, Ting Fu, Yifan Shen, Shu Ma, Kun Qian, Lingjun Zhu, Chao Shi, Yin Zhang, Ming Liu, Zeke Wang
2024 A* conf
GNN-assisted Back-side Clock Routing Methodology for Advance Technologies.
DAC
Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto García Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim
2024 A conf
Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs.
ISLPED
Lingjun Zhu, Jiawei Hu, Gauthaman Murali, Sung Kyu Lim
2024 A conf
What's the Story in EBS Glory: Evolutions and Lessons in Building Cloud Block Store.
FAST
Weidong Zhang, Erci Xu, Qiuping Wang, Xiaolu Zhang, Yuesheng Gu, Zhenwei Lu, Tao Ouyang, Guanqun Dai, Wenwen Peng, Zhe Xu, Shuo Zhang, Dong Wu, Yilei Peng, Tianyun Wang, Haoran Zhang, Jiasheng Wang, Wenyuan Yan, Yuanyuan Dong, Wenhui Yao, Zhongjie Wu, Lingjun Zhu, Chao Shi, Yinhu Wang, Rong Liu, Junping Wu, Jiaji Zhu, Jiesheng Wu
2023 A conf
A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node.
ISLPED
Sandra Maria Shaji, Lingjun Zhu, Jun-Sik Yoon, Sung Kyu Lim
2023 J jnl
Buffer-Based High-Coverage and Low-Overhead Request Event Monitoring in the Cloud.
IEEE/ACM Trans. Netw.
Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang, Xiang Deng, Cheng Zhou, Lu Lu
2023 — conf
Deploying User-space TCP at Cloud Scale with LUNA.
USENIX ATC
Lingjun Zhu, Yifan Shen, Erci Xu, Bo Shi, Ting Fu, Shu Ma, Shuguang Chen, Zhongyu Wang, Haonan Wu, Xingyu Liao, Zhendan Yang, Zhongqing Chen, Wei Lin, Yijun Hou, Rong Liu, Chao Shi, Jiaji Zhu, Jiesheng Wu
2023 A* conf
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.
DAC
Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim
2023 A* conf
INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps.
DAC
Lingjun Zhu, Sung Kyu Lim
2023 J jnl
On Continuing DNN Accelerator Architecture Scaling Using Tightly Coupled Compute-on-Memory 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst.
Gauthaman Murali, Aditya Iyer, Lingjun Zhu, Jianming Tong, Francisco Muñoz-Martínez, Srivatsa Rangachar Srinivasa, Tanay Karnik, Tushar Krishna, Sung Kyu Lim
2023 A* conf
SmartDS: Middle-Tier-centric SmartNIC Enabling Application-aware Message Split for Disaggregated Block Storage.
ISCA
Jie Zhang, Hongjing Huang, Lingjun Zhu, Shu Ma, Dazhong Rong, Yijun Hou, Mo Sun, Chaojie Gu, Peng Cheng, Chao Shi, Zeke Wang
2023 J jnl
What are the actual needs of visually impaired people?
Displays
Menghan Hu, Qingyi Zhu, Lingjun Zhu
2022 A conf
3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs.
ISLPED
Lingjun Zhu, Nesara Eranna Bethur, Yi-Chen Lu, Youngsang Cho, Yunhyeok Im, Sung Kyu Lim
2022 J jnl
A Machine Learning-Powered Tier Partitioning Methodology for Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Yi-Chen Lu, Sai Pentapati, Lingjun Zhu, Gauthaman Murali, Kambiz Samadi, Sung Kyu Lim
2022 Misc conf
Buffer-based End-to-end Request Event Monitoring in the Cloud.
NSDI
Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang
2022 J jnl
Design Automation and Test Solutions for Monolithic 3D ICs.
ACM J. Emerg. Technol. Comput. Syst.
Lingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim
2022 A* conf
From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud.
SIGCOMM
Rui Miao, Lingjun Zhu, Shu Ma, Kun Qian, Shujun Zhuang, Bo Li, Shuguang Cheng, Jiaqi Gao, Yan Zhuang, Pengcheng Zhang, Rong Liu, Chao Shi, Binzhang Fu, Jiaji Zhu, Jiesheng Wu, Dennis Cai, Hongqiang Harry Liu
2021 — conf
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators.
ISQED
Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna
2021 J jnl
High-Performance Logic-on-Memory Monolithic 3-D IC Designs for Arm Cortex-A Processors.
IEEE Trans. Very Large Scale Integr. Syst.
Lingjun Zhu, Lennart Bamberg, Sai Surya Kiran Pentapati, Kyungwook Chang, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Brian Cline, Saurabh Sinha, Xiaoqing Xu, Alberto García-Ortiz, Sung Kyu Lim
2021 J jnl
Identification of key genes, pathways, and associated comorbidities in chikungunya infection: insights from system biology analysis.
Netw. Model. Anal. Health Informatics Bioinform.
Lingjun Zhu, Xiaodong Wang, Tania Akter Asa, Md. Ali Hossain
2021 A* conf
Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options.
DAC
Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim
2021 — conf
Physical Design Challenges and Solutions for Emerging Heterogeneous 3D Integration Technologies.
ISPD
Lingjun Zhu, Sung Kyu Lim
2021 A conf
Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture.
ISLPED
Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim
2020 J jnl
Architecture, Dataflow and Physical Design Implications of 3D-ICs for DNN-Accelerators.
CoRR
Jan Moritz Joseph, Ananda Samajdar, Lingjun Zhu, Rainer Leupers, Sung Kyu Lim, Thilo Pionteck, Tushar Krishna
2020 A* conf
Flow Event Telemetry on Programmable Data Plane.
SIGCOMM
Yu Zhou, Chen Sun, Hongqiang Harry Liu, Rui Miao, Shi Bai, Bo Li, Zhilong Zheng, Lingjun Zhu, Zhen Shen, Yongqing Xi, Pengcheng Zhang, Dennis Cai, Ming Zhang, Mingwei Xu
2020 — conf
Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICs.
ISPD
Lingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim
2020 J jnl
Heterogeneous 3D Integration for a RISC-V System With STT-MRAM.
IEEE Comput. Archit. Lett.
Lingjun Zhu, Lennart Bamberg, Anthony Agnesina, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Julien Ryckaert, Alberto García-Ortiz, Sung Kyu Lim
2020 A conf
Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs.
DATE
Lennart Bamberg, Alberto García Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim
2020 A* conf
TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs.
DAC
Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim
2020 — conf
The Financial Archives Management System of University Based on Computer Network Technology.
CSIA (2)
Lingjun Zhu
2020 J jnl
Vortex: OpenCL Compatible RISC-V GPGPU.
CoRR
Fares Elsabbagh, Blaise Tine, Priyadarshini Roshan, Ethan Lyons, Euna Kim, Da Eun Shim, Lingjun Zhu, Sung Kyu Lim, Hyesoon Kim
2019 J jnl
A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology.
IEEE Micro
Sai Pentapati, Lingjun Zhu, Lennart Bamberg, Da Eun Shim, Alberto García Ortiz, Sung Kyu Lim
2013 J jnl
Study on Steering by Wire Controller Based on Improved H∞ Algorithm.
Int. J. Online Eng.
Huipeng Chen, Lingjun Zhu, Xiaofan Liu, Sunan Yu, Dingcheng Zhao