| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Syst. Archit.
|
| 2025 | J | jnl |
J. Circuits Syst. Comput.
|
| 2025 | J | jnl |
J. Syst. Archit.
|
| 2024 | J | jnl |
IEEE Trans. Netw. Sci. Eng.
|
| 2024 | J | jnl |
Int. J. Comput. Sci. Eng.
|
| 2024 | — | conf |
AIoTC
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2023 | — | conf |
CSCloud/EdgeCom
|
| 2023 | — | conf |
CSCloud/EdgeCom
|
| 2023 | J | jnl |
Connect. Sci.
|
| 2023 | J | jnl |
Int. J. Commun. Syst.
|
| 2023 | J | jnl |
Soft Comput.
|
| 2023 | — | conf |
BigDataSecurity/HPSC/IDS
|
| 2023 | J | jnl |
Connect. Sci.
|
| 2023 | J | jnl |
Connect. Sci.
|
| 2023 | — | conf |
SmartCloud
|
| 2023 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Neural Process. Lett.
|
| 2022 | J | jnl |
Appl. Intell.
|
| 2022 | J | jnl |
IEEE Internet Things J.
|
| 2022 | — | conf |
SmartCom
|
| 2022 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2021 | — | conf |
CSCloud/EdgeCom
|
| 2021 | J | jnl |
Appl. Intell.
|
| 2021 | J | jnl |
Connect. Sci.
|
| 2021 | J | jnl |
Connect. Sci.
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
Connect. Sci.
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | — | conf |
SmartCloud
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Neural Process. Lett.
|
| 2020 | — | conf |
SmartBlock
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Int. J. Embed. Syst.
|
| 2020 | — | conf |
BlockSys
|
| 2020 | J | jnl |
J. Sensors
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
SmartCom
|
| 2019 | — | conf |
SmartCloud
|
| 2019 | J | jnl |
Genom. Proteom. Bioinform.
|
| 2019 | — | conf |
BlockSys
|
| 2019 | — | conf |
SmartBlock
|
| 2017 | — | conf |
ICAIT
|