| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Biomed. Signal Process. Control.
|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2026 | J | jnl |
IEEE Commun. Lett.
|
| 2026 | J | jnl |
IEEE Internet Things J.
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | J | jnl |
IEEE Commun. Lett.
|
| 2025 | A* | conf |
ICLR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
EURASIP J. Audio Speech Music. Process.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
J. Appl. Math. Comput.
|
| 2024 | J | jnl |
Networks Heterog. Media
|
| 2024 | J | jnl |
CoRR
|
| 2024 | B | conf |
WCNC
|
| 2024 | J | jnl |
BMC Medical Imaging
|
| 2024 | J | jnl |
PDF-WuKong: A Large Multimodal Model for Efficient Long PDF Reading with End-to-End Sparse Sampling.
CoRR
|
| 2024 | J | jnl |
Neural Comput. Appl.
|
| 2024 | — | conf |
PEAI
|
| 2023 | C | conf |
HealthCom
|
| 2023 | — | conf |
CISP-BMEI
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | — | conf |
HCI (14)
|
| 2023 | A* | conf |
KDD
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Proc. ACM Manag. Data
|
| 2023 | — | conf |
DAI
|
| 2022 | — | conf |
SmartWorld/UIC/ScalCom/DigitalTwin/PriComp/Meta
|
| 2022 | J | jnl |
Proc. VLDB Endow.
|
| 2022 | J | jnl |
J. Comput. Phys.
|
| 2021 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2021 | A | conf |
CIKM
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
JOCN
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Sensors
|
| 2019 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2018 | J | jnl |
IEEE J. Sel. Areas Commun.
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | J | jnl |
计算机科学
|
| 2018 | J | jnl |
计算机科学
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2017 | J | jnl |
CoRR
|
| 2016 | — | conf |
iThings/GreenCom/CPSCom/SmartData
|
| 2016 | — | conf |
iThings/GreenCom/CPSCom/SmartData
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | J | jnl |
IEEE Trans. Commun.
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2015 | J | jnl |
IEEE J. Solid State Circuits
|
| 2015 | B | conf |
ICPADS
|
| 2015 | C | conf |
ISCAS
|
| 2015 | J | jnl |
Sensors
|
| 2015 | C | conf |
ISCAS
|
| 2015 | — | conf |
VTC Fall
|
| 2015 | B | conf |
GLOBECOM
|
| 2015 | B | conf |
PIMRC
|
| 2014 | — | conf |
HCI (19)
|
| 2014 | J | jnl |
Multim. Tools Appl.
|
| 2014 | J | jnl |
IEICE Electron. Express
|
| 2014 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2013 | A* | conf |
AAAI
|
| 2013 | A* | conf |
AAAI
|
| 2013 | — | conf |
HCI (20)
|
| 2013 | — | conf |
HCI (20)
|
| 2013 | — | conf |
NEMS
|
| 2013 | — | conf |
CrownCom
|
| 2013 | J | jnl |
Asia Pac. J. Oper. Res.
|
| 2013 | — | conf |
ICC
|
| 2013 | B | conf |
GLOBECOM
|
| 2013 | — | conf |
GECCO (Companion)
|
| 2013 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2013 | B | conf |
WCNC
|
| 2012 | — | conf |
ICME Workshops
|
| 2012 | B | conf |
ICPR
|
| 2012 | — | conf |
VTC Fall
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2012 | — | conf |
DySPAN
|
| 2012 | B | conf |
SMC
|
| 2012 | B | conf |
ICIP
|
| 2012 | B | conf |
ICPR
|
| 2012 | B | conf |
ICPADS
|
| 2012 | — | conf |
ICME Workshops
|
| 2011 | J | jnl |
Microelectron. Reliab.
|
| 2011 | — | conf |
MILCOM
|
| 2011 | — | conf |
HCI (15)
|
| 2009 | — | conf |
NEMS
|
| 2009 | — | conf |
NEMS
|
| 2007 | — | conf |
ICNC (2)
|
| 2003 | J | jnl |
IEEE Trans. Reliab.
|
| 2001 | — | conf |
ASP-DAC
|
| 1999 | A | conf |
ISSRE
|