Liang Chen

21 papers A* 2A 4Journal 11Unranked 4
YearRankTypeTitle / Venue / Authors
2025 J jnl
An Analytical 3D-IC Thermal Simulation Framework Using Adaptive Rectangular Approximation and Conformal Mesh Method.
IEEE Trans. Very Large Scale Integr. Syst.
Pengju Zhang, Kuoyuan Jia, Yubiao Liu, Chenfeng Ye, Junhan Huang, Wenxing Zhu, Li Huang, Min Tang, Liang Chen, Jianhua Zhang
2025 J jnl
Delay-Driven Rectilinear Steiner Tree Construction.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Hongxi Wu, Xingquan Li, Liang Chen, Bei Yu, Wenxing Zhu
2025 J jnl
PISOV: Physics-Informed Separation of Variables Solvers for Full-Chip Thermal Analysis.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Liang Chen, Wenxing Zhu, Min Tang, Sheldon X.-D. Tan, Jun-Fa Mao, Jianhua Zhang
2024 A* conf
Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages.
DAC
Shunxiang Lan, Min Tang, Liang Chen, Junfa Mao
2023 A conf
Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks.
ICCAD
Liang Chen, Jincong Lu, Wentian Jin, Sheldon X.-D. Tan
2023 J jnl
Hot-spot aware thermoelectric array based cooling for multicore processors.
Integr.
Jinwei Zhang, Sheriff Sadiqbatcha, Liang Chen, Cuong Thi, Sachin Sachdeva, Hussam Amrouch, Sheldon X.-D. Tan
2023 J jnl
Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Liang Chen, Wentian Jin, Mohammadamir Kavousi, Subed Lamichhane, Sheldon X.-D. Tan
2023 A conf
PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks.
ICCAD
Subed Lamichhane, Wentian Jin, Liang Chen, Mohammadamir Kavousi, Sheldon X.-D. Tan
2023 J jnl
Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Liang Chen, Wentian Jin, Jinwei Zhang, Sheldon X.-D. Tan
2022 J jnl
Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Liang Chen, Sheriff Sadiqbatcha, Hussam Amrouch, Sheldon X.-D. Tan
2022 — conf
Fast Electromigration Stress Analysis Considering Spatial Joule Heating Effects.
ASP-DAC
Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan
2022 — conf
Fast Thermal Analysis for Chiplet Design based on Graph Convolution Networks.
ASP-DAC
Liang Chen, Wentian Jin, Sheldon X.-D. Tan
2022 A conf
HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network.
ICCAD
Wentian Jin, Liang Chen, Subed Lamichhane, Mohammadamir Kavousi, Sheldon X.-D. Tan
2021 J jnl
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
2021 A* conf
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks.
DAC
Wentian Jin, Liang Chen, Sheriff Sadiqbatcha, Shaoyi Peng, Sheldon X.-D. Tan
2021 J jnl
Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Xiaoyi Wang, Shaobin Ma, Sheldon X.-D. Tan, Chase Cook, Liang Chen, Jianlei Yang, Wenjian Yu
2021 J jnl
Robust power grid network design considering EM aging effects for multi-segment wires.
Integr.
Han Zhou, Liang Chen, Sheldon X.-D. Tan
2020 — conf
An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks.
ASP-DAC
Shaobin Ma, Xiaoyi Wang, Sheldon X.-D. Tan, Liang Chen, Jian He
2020 — conf
Data-Driven Fast Electrostatics and TDDB Aging Analysis.
MLCAD
Shaoyi Peng, Wentian Jin, Liang Chen, Sheldon X.-D. Tan
2020 A conf
Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires.
ICCAD
Mohammadamir Kavousi, Liang Chen, Sheldon X.-D. Tan
2020 J jnl
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires.
IEEE Trans. Very Large Scale Integr. Syst.
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao