| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ISSCC
|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2026 | — | conf |
ISSCC
|
| 2026 | J | jnl |
J. Am. Medical Informatics Assoc.
|
| 2025 | — | conf |
ISSCC
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
DAC
|
| 2025 | A* | conf |
HPCA
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2025 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
HPCA
|
| 2025 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | A* | conf |
MICRO
|
| 2025 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2025 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2025 | J | jnl |
Sci. China Inf. Sci.
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
CoRR
|
| 2024 | — | conf |
ISSCC
|
| 2024 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2024 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2024 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
BMC Bioinform.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ASPLOS (3)
|
| 2024 | J | jnl |
IEEE Trans. Computers
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | A* | conf |
DAC
|
| 2024 | — | conf |
HOST
|
| 2024 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2023 | — | conf |
A-SSCC
|
| 2023 | — | conf |
A-SSCC
|
| 2023 | — | conf |
VLSI Technology and Circuits
|
| 2023 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2023 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2023 | — | conf |
HOST
|
| 2023 | — | conf |
AICAS
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
J. Comput. Sci. Technol.
|
| 2023 | J | jnl |
Artif. Intell. Medicine
|
| 2023 | A* | conf |
MICRO
|
| 2023 | — | conf |
A-SSCC
|
| 2023 | A* | conf |
DAC
|
| 2023 | — | conf |
ISSCC
|
| 2023 | A* | conf |
ISCA
|
| 2023 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | A* | conf |
ISCA
|
| 2023 | A* | conf |
DAC
|
| 2023 | — | conf |
ISSCC
|
| 2023 | A* | conf |
ISCA
|
| 2023 | A* | conf |
DAC
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | A* | conf |
ISCA
|
| 2023 | — | conf |
AICAS
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | — | conf |
ISSCC
|
| 2023 | A* | conf |
MICRO
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | — | — |
|
| 2023 | — | conf |
A-SSCC
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2022 | — | conf |
ISSCC
|
| 2022 | — | conf |
ISSCC
|
| 2022 | — | conf |
ISSCC
|
| 2022 | — | conf |
ISSCC
|
| 2022 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2022 | — | conf |
IPDPS Workshops
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2022 | A* | conf |
HPCA
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2022 | A* | conf |
ISCA
|
| 2022 | J | jnl |
Characterizing Approximate Adders and Multipliers for Mitigating Aging and Temperature Degradations.
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2022 | J | jnl |
J. Biomed. Informatics
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | — | conf |
ICTA
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | A* | conf |
DAC
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
J. Biomed. Informatics
|
| 2022 | A* | conf |
DAC
|
| 2022 | — | ch. |
Approximate Computing
|
| 2022 | A* | conf |
DAC
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | — | book |
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2022 | A* | conf |
HPCA
|
| 2021 | — | conf |
ISSCC
|
| 2021 | — | conf |
ISSCC
|
| 2021 | — | conf |
VLSI Circuits
|
| 2021 | J | jnl |
IEEE Trans. Multim.
|
| 2021 | — | conf |
VLSI Circuits
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | A* | conf |
ISCA
|
| 2021 | A* | conf |
DAC
|
| 2021 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | A* | conf |
HPCA
|
| 2021 | — | conf |
AICAS
|
| 2021 | A | conf |
DATE
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | — | conf |
AICAS
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2020 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2020 | Misc | conf |
FCCM
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2020 | — | conf |
ICDSP
|
| 2020 | J | jnl |
ACM Comput. Surv.
|
| 2020 | — | conf |
A-SSCC
|
| 2020 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
Proc. IEEE
|
| 2020 | A* | conf |
MICRO
|
| 2020 | A* | conf |
DAC
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Signal Process.
|
| 2020 | A* | conf |
ISCA
|
| 2020 | J | jnl |
IACR Trans. Cryptogr. Hardw. Embed. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Computers
|
| 2020 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2020 | Misc | conf |
ICASSP
|
| 2020 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2020 | A* | conf |
DAC
|
| 2020 | A* | conf |
MICRO
|
| 2019 | A* | conf |
DAC
|
| 2019 | — | conf |
VLSI Circuits
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2019 | A* | conf |
DAC
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2019 | J | jnl |
A Lifetime Reliability-Constrained Runtime Mapping for Throughput Optimization in Many-Core Systems.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | C | conf |
ISCAS
|
| 2019 | — | conf |
NANOARCH
|
| 2019 | J | jnl |
IEEE J. Solid State Circuits
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2019 | — | ch. |
Approximate Circuits
|
| 2019 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2019 | A | conf |
FPGA
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | A* | conf |
MICRO
|
| 2019 | J | jnl |
IEEE Trans. Multim.
|
| 2019 | — | conf |
Hot Chips Symposium
|
| 2019 | A* | conf |
DAC
|
| 2019 | J | jnl |
Nucleic Acids Res.
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Computers
|
| 2019 | — | book |
|
| 2019 | — | conf |
NEWCAS
|
| 2019 | J | jnl |
Integr.
|
| 2019 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2019 | — | conf |
ISVLSI
|
| 2019 | A | conf |
ICCAD
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2019 | C | conf |
ASRU
|
| 2019 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | — | conf |
VLSI Circuits
|
| 2018 | — | conf |
A-SSCC
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | — | conf |
CyberC
|
| 2018 | J | jnl |
IEEE J. Solid State Circuits
|
| 2018 | A | conf |
DATE
|
| 2018 | J | jnl |
IEEE Trans. Signal Process.
|
| 2018 | C | conf |
ISCAS
|
| 2018 | — | conf |
VLSI Circuits
|
| 2018 | A* | conf |
DAC
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | C | conf |
ISCAS
|
| 2018 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
DRMaSV: Enhanced Capability Against Hardware Trojans in Coarse Grained Reconfigurable Architectures.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
Neurocomputing
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2018 | A* | conf |
DAC
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | A* | conf |
ISCA
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2018 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2017 | A* | conf |
DAC
|
| 2017 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2017 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2017 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2017 | — | conf |
NVMSA
|
| 2017 | A* | conf |
ISCA
|
| 2017 | J | jnl |
IEEE Syst. J.
|
| 2017 | Misc | conf |
CODES+ISSS
|
| 2017 | Misc | conf |
FCCM
|
| 2017 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2017 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2017 | C | conf |
ISCAS
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | — | conf |
ASP-DAC
|
| 2017 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2017 | J | jnl |
IET Image Process.
|
| 2017 | A | conf |
FPGA
|
| 2017 | A | conf |
FPGA
|
| 2017 | J | jnl |
IEEE Trans. Signal Process.
|
| 2017 | C | conf |
ISCAS
|
| 2017 | A* | conf |
DAC
|
| 2017 | Misc | conf |
SAC
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2017 | J | jnl |
IEEE Access
|
| 2016 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2016 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2016 | J | jnl |
Sci. China Inf. Sci.
|
| 2016 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2016 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | A* | conf |
DAC
|
| 2016 | J | jnl |
Sci. China Inf. Sci.
|
| 2016 | — | conf |
NANOARCH
|
| 2016 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2016 | — | conf |
ASP-DAC
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | J | jnl |
IEEE Trans. Reliab.
|
| 2016 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | A* | conf |
DAC
|
| 2015 | J | jnl |
Sensors
|
| 2015 | — | conf |
CICC
|
| 2015 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | A | conf |
FPGA
|
| 2015 | A | conf |
WACV
|
| 2015 | J | jnl |
Sensors
|
| 2015 | A | conf |
FPGA
|
| 2015 | J | jnl |
IEEE Trans. Reliab.
|
| 2015 | C | conf |
ISCAS
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2015 | A | conf |
ICCAD
|
| 2015 | A* | conf |
DAC
|
| 2015 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | J | jnl |
IEEE Trans. Multim.
|
| 2015 | C | conf |
ICCE
|
| 2015 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | J | jnl |
J. Circuits Syst. Comput.
|
| 2015 | A | conf |
DATE
|
| 2015 | J | jnl |
IEEE Trans. Multim.
|
| 2015 | A | conf |
FPGA
|
| 2015 | J | jnl |
ACM Trans. Reconfigurable Technol. Syst.
|
| 2015 | C | conf |
ICCE
|
| 2015 | A* | conf |
DAC
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
Sensors
|
| 2015 | J | jnl |
Sensors
|
| 2015 | A | conf |
DATE
|
| 2015 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2015 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2015 | C | conf |
ISCAS
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | A | conf |
FPGA
|
| 2015 | A | conf |
DATE
|
| 2015 | C | conf |
ICCE
|
| 2015 | J | jnl |
Sci. China Inf. Sci.
|
| 2015 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2014 | C | conf |
ISCAS
|
| 2014 | B | conf |
ICPR
|
| 2014 | J | jnl |
Sensors
|
| 2014 | J | jnl |
IEEE Trans. Reliab.
|
| 2014 | — | conf |
ROBIO
|
| 2014 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2014 | B | conf |
FPL
|
| 2014 | Misc | conf |
FCCM
|
| 2014 | A | conf |
DATE
|
| 2014 | — | conf |
IPDPS Workshops
|
| 2014 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | — | conf |
MWSCAS
|
| 2014 | C | conf |
ISCAS
|
| 2014 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | C | conf |
FIE
|
| 2013 | C | conf |
ISCAS
|
| 2013 | J | jnl |
J. Syst. Archit.
|
| 2013 | J | jnl |
IEICE Electron. Express
|
| 2013 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2013 | C | conf |
ISCAS
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2013 | J | jnl |
Sci. China Inf. Sci.
|
| 2013 | — | conf |
CICC
|
| 2013 | C | conf |
ISCAS
|
| 2013 | — | conf |
NAS
|
| 2013 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2013 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2013 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2013 | J | jnl |
Sci. China Inf. Sci.
|
| 2013 | C | conf |
ISCAS
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2013 | — | conf |
EMC/HumanCom
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2013 | A* | conf |
DAC
|
| 2013 | J | jnl |
Sci. China Inf. Sci.
|
| 2013 | — | conf |
NAS
|
| 2013 | — | conf |
CICC
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2012 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2012 | J | jnl |
IEICE Trans. Electron.
|
| 2012 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2012 | J | jnl |
IEICE Trans. Commun.
|
| 2012 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2012 | C | conf |
ISCAS
|
| 2011 | — | conf |
ASICON
|
| 2011 | — | conf |
ASICON
|
| 2010 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2010 | C | conf |
ISCAS
|
| 2010 | C | conf |
ISCAS
|
| 2010 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2010 | — | conf |
APCCAS
|
| 2010 | J | jnl |
IEICE Trans. Commun.
|
| 2010 | — | conf |
APCCAS
|
| 2010 | C | conf |
ISCAS
|
| 2010 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2010 | C | conf |
NPC
|
| 2009 | C | conf |
ISCAS
|
| 2009 | J | jnl |
Integr.
|
| 2009 | J | jnl |
Sci. China Ser. F Inf. Sci.
|
| 2009 | J | jnl |
IEICE Trans. Electron.
|
| 2007 | C | conf |
ISCAS
|
| 2006 | — | conf |
APCCAS
|
| 2005 | — | conf |
CICC
|
| 2004 | J | jnl |
IEEE J. Solid State Circuits
|
| 2002 | — | conf |
APCCAS (2)
|