Lei Su

23 papers Journal 23
YearRankTypeTitle / Venue / Authors
2026 J jnl
A fault mechanism-guided interpretable causal disentanglement domain generalization detection method for typical faults of induction motor.
Adv. Eng. Informatics
You He, Xinwei Zhao, Lei Su, Jiefei Gu, Ke Li, Michael G. Pecht
2025 J jnl
A Semantic Transferable Feature Extraction Strategy for Cross-Domain Detection.
IEEE Trans. Ind. Informatics
Siyu Zhang, Lei Su, Ke Li, Fucai Li
2025 J jnl
Semi-supervised dual-constraint centroid contrastive prototypical network for flip chip defect detection under limited labeled data.
Eng. Appl. Artif. Intell.
Yunxia Lou, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht
2024 J jnl
Category-level selective dual-adversarial network using significance-augmented unsupervised domain adaptation for surface defect detection.
Expert Syst. Appl.
Siyu Zhang, Lei Su, Jiefei Gu, Ke Li, Weitian Wu, Michael G. Pecht
2024 J jnl
Flip-chip solder bumps defect detection using a self-search lightweight framework.
Adv. Eng. Informatics
Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht
2024 J jnl
Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection.
IEEE Trans. Ind. Informatics
Yu Sun, Lei Su, Jiefei Gu, Xinwei Zhao, Ke Li, Michael G. Pecht
2023 J jnl
A Novel Three-Probability Spaces Logic Decoupling Distillation for Flip-Chip Defect Detection.
IEEE Trans. Instrum. Meas.
Yu Sun, Lei Su, Jiefei Gu, Ke Li, Michael G. Pecht
2021 J jnl
Sparse Reconstruction for Microdefect Detection of Two-Dimensional Ultrasound Image Based on Blind Estimation.
IEEE Trans. Ind. Electron.
Lei Su, Xiaonan Yu, Ke Li, Jiefei Gu, Michael G. Pecht
2020 J jnl
Simulation and Experimental Investigation on Active Thermography Test of the Solder Balls.
IEEE Trans. Ind. Informatics
Libo Zhao, Zhenzhi He, Zengxiang Wang, Lei Su, Xiangning Lu
2019 J jnl
A New Rotation Machinery Fault Diagnosis Method Based on Deep Structure and Sparse Least Squares Support Vector Machine.
IEEE Access
Ke Li, Rui Zhang, Fucai Li, Lei Su, Huaqing Wang, Peng Chen
2019 J jnl
A novel fault diagnosis algorithm for rotating machinery based on a sparsity and neighborhood preserving deep extreme learning machine.
Neurocomputing
Ke Li, Meng Xiong, Fucai Li, Lei Su, Jingjing Wu
2019 J jnl
Simulation and Experimental Verification of Edge Blurring Phenomenon in Microdefect Inspection Based on High-Frequency Ultrasound.
IEEE Access
Lei Su, Xiaonan Yu, Ke Li, Xingyan Yao, Michael G. Pecht
2019 J jnl
The Explosive Nature of Tab Burrs in Li-Ion Batteries.
IEEE Access
Xingyan Yao, Saurabh Saxena, Lei Su, Michael G. Pecht
2018 J jnl
Detection of Micro Solder Balls Using Active Thermography Technology and K-Means Algorithm.
IEEE Trans. Ind. Informatics
Xiangning Lu, Zhenzhi He, Lei Su, Mengying Fan, Fan Liu, Guanglan Liao, Tielin Shi
2018 J jnl
Using GA-SVM for defect inspection of flip chips based on vibration signals.
Microelectron. Reliab.
Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su
2017 J jnl
New Particle Filter Based on GA for Equipment Remaining Useful Life Prediction.
Sensors
Ke Li, Jingjing Wu, Qiuju Zhang, Lei Su, Peng Chen
2017 J jnl
Weighted Kernel Entropy Component Analysis for Fault Diagnosis of Rolling Bearings.
Sensors
Hongdi Zhou, Tielin Shi, Guanglan Liao, Jianping Xuan, Jie Duan, Lei Su, Zhenzhi He, Wuxing Lai
2016 J jnl
Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging.
Sensors
Yichun Zhang, Tielin Shi, Lei Su, Xiao Wang, Yuan Hong, Kepeng Chen, Guanglan Liao
2016 J jnl
X-ray inspection of TSV defects with self-organizing map network and Otsu algorithm.
Microelectron. Reliab.
Junjie Shen, Pengfei Chen, Lei Su, Tielin Shi, Zirong Tang, Guanglan Liao
2015 J jnl
Genetic algorithms for defect detection of flip chips.
Microelectron. Reliab.
Lei Su, Tielin Shi, Li Du, Xiangning Lu, Guanglan Liao
2015 J jnl
Using RBF networks for detection and prediction of flip chip with missing bumps.
Microelectron. Reliab.
Guanglan Liao, Li Du, Lei Su, Miao Zeng, Lei Nie, Tielin Shi
2015 J jnl
Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration.
Microelectron. Reliab.
Guanglan Liao, Pengfei Chen, Li Du, Lei Su, Zhiping Liu, Zirong Tang, Tielin Shi
2013 J jnl
Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer.
Sensors
Lei Su, Tielin Shi, Zhensong Xu, Xiangning Lu, Guanglan Liao