| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
ICPHM
|
| 2022 | J | jnl |
Mechanic-Electric-Thermal Directly Coupling Simulation Method of Lamb Wave under Temperature Effect.
Sensors
|
| 2022 | — | conf |
ICPHM
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
Pattern Recognit.
|
| 2018 | J | jnl |
Sensors
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | J | jnl |
Sensors
|
| 2016 | J | jnl |
Sensors
|
| 2013 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2013 | J | jnl |
Sensors
|
| 2012 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2012 | J | jnl |
Sensors
|
| 2009 | J | jnl |
Expert Syst. Appl.
|