Lan Peng

13 papers Journal 5Unranked 8
YearRankTypeTitle / Venue / Authors
2022 J jnl
VeRoViz: A Vehicle Routing Visualization Toolkit.
INFORMS J. Comput.
Lan Peng, Chase C. Murray
2021 J jnl
ICINet: ICI-Aware Neural Network Based Channel Estimation for Rapidly Time-Varying OFDM Systems.
CoRR
Yi Sun, Hong Shen, Zhenguo Du, Lan Peng, Chunming Zhao
2021 J jnl
ICINet: ICI-Aware Neural Network Based Channel Estimation for Rapidly Time-Varying OFDM Systems.
IEEE Commun. Lett.
Yi Sun, Hong Shen, Zhenguo Du, Lan Peng, Chunming Zhao
2020 J jnl
Dynamic Edge Access System in IoT Environment.
IEEE Internet Things J.
Huifeng Wu, Danfeng Sun, Lan Peng, Yuan Yao, Jia Wu, Quan Z. Sheng, Yi Yan
2017 — conf
A fleet-level selective maintenance model for long-distance highway transportation considering stochastic repair quality.
ICSRS
Lan Peng, Lin Ma, Naichao Wang
2017 — conf
Power Allocation for OFDM with Index Modulation.
VTC Spring
Qianli Ma, Ping Yang, Pengfei Wang, Lan Peng, Xu He, Bin Fu, Yue Xiao
2016 — conf
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.
3DIC
Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann
2016 — conf
Performance Analysis of Spatial Modulation OFDM System with N-Continuous Precoder.
VTC Spring
Feng Yu, Xia Lei, Lan Peng, Yue Xiao, Peng Wei, Xiaojie Wen
2016 J jnl
Subcarrier Allocation for OFDM With Index Modulation.
IEEE Commun. Lett.
Qianli Ma, Yue Xiao, Lilin Dan, Ping Yang, Lan Peng, Shaoqian Li
2015 — conf
A modeling and simulation approach for support network considering multi-service flows.
IEEM
Xiang Li, Lin Ma, Lan Peng, Jingfu Wang
2015 — conf
Energy-Efficient Proportional Resource Allocation in Uplink OFDMA Systems.
VTC Spring
Lan Peng, Saidan Gong, Lilin Dan, Yue Xiao
2015 — conf
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.
3DIC
Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee
2010 — conf
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement.
3DIC
Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan