Kuo-Ning Chiang

16 papers Journal 16
YearRankTypeTitle / Venue / Authors
2016 J jnl
Characterization on acceleration-factor equation for packaging-solder joint reliability.
Microelectron. Reliab.
K.-C. Wu, Kuo-Ning Chiang
2012 J jnl
Light degradation test and design of thermal performance for high-power light-emitting diodes.
Microelectron. Reliab.
Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang
2011 J jnl
Measurement and simulation of interfacial adhesion strength between SiO
Microelectron. Reliab.
Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kuo-Ning Chiang
2011 J jnl
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test.
Microelectron. Reliab.
T. Y. Hung, S. Y. Chiang, C. J. Huang, Chang-Chun Lee, Kuo-Ning Chiang
2009 J jnl
Fabrication process simulation and reliability improvement of high-brightness LEDs.
Microelectron. Reliab.
Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, Kuo-Ning Chiang
2008 J jnl
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact.
Microelectron. Reliab.
Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang
2008 J jnl
The mechanical stress resistance capability of stress buffer structures in analog devices.
Microelectron. Reliab.
Hsiao-Tung Ku, Kuo-Ning Chiang
2007 J jnl
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis.
Microelectron. Reliab.
Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang
2007 J jnl
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure.
Microelectron. Reliab.
C. C. Chiu, H. H. Chang, Chang-Chun Lee, C. C. Hsia, Kuo-Ning Chiang
2007 J jnl
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.
Microelectron. Reliab.
Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang
2006 J jnl
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
Microelectron. Reliab.
Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang
2006 J jnl
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.
Microelectron. Reliab.
Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang
2006 J jnl
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis.
Microelectron. Reliab.
Ming-Chih Yew, C. Y. Chou, C. S. Huang, W. K. Yang, Kuo-Ning Chiang
2006 J jnl
Thermal resistance analysis and validation of flip chip PBGA packages.
Microelectron. Reliab.
Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang
2004 J jnl
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application.
Microelectron. Reliab.
Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang
2003 J jnl
Impact of probing procedure on flip chip reliability.
Microelectron. Reliab.
Kuo-Ming Chen, Kuo-Ning Chiang