Kuo-Ming Chen

12 papers B 1Journal 8Unranked 3
YearRankTypeTitle / Venue / Authors
2019 B conf
Lifetime Maximization for Uplink Transmission in UAV-Enabled Wireless Networks.
WCNC
Kuo-Ming Chen, Tsung-Hui Chang, Ta-Sung Lee
2019 J jnl
Machine Learning Based Automatic Diagnosis in Mobile Communication Networks.
IEEE Trans. Veh. Technol.
Kuo-Ming Chen, Tsung-Hui Chang, Kai-Cheng Wang, Ta-Sung Lee
2018 — conf
Low-Complexity Beam Selection for Hybrid Precoded Multi-User mmWave Communications.
ICSPCC
Kuo-Ming Chen, Yun-Han Pan, Ta-Sung Lee
2015 J jnl
Energy-Efficient Deterministic Adaptive Beamforming Algorithms for Distributed Sensor/Relay Networks.
CoRR
Chun-Wei Li, Kuo-Ming Chen, Po-Chun Fu, Wei-Ning Chen, Che Lin
2011 J jnl
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology.
Microelectron. Reliab.
Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen
2007 J jnl
A longest prefix first search tree for IP lookup.
Comput. Networks
Lih-Chyau Wuu, Tzong-Jye Liu, Kuo-Ming Chen
2007 J jnl
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.
Microelectron. Reliab.
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu
2006 J jnl
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
Microelectron. Reliab.
Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang
2006 J jnl
Thermal resistance analysis and validation of flip chip PBGA packages.
Microelectron. Reliab.
Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang
2005 — conf
A longest prefix first search tree for IP lookup.
ICC
Lih-Chyau Wuu, Kuo-Ming Chen, Tzong-Jye Liu
2004 — conf
Reconstruction and Fusion of Multi-modality Spinal Images.
CISST
Kuo-Ming Chen, Yuan-Tsung Chen, Ming-Shi Wang
2003 J jnl
Impact of probing procedure on flip chip reliability.
Microelectron. Reliab.
Kuo-Ming Chen, Kuo-Ning Chiang