| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Wirel. Networks
|
| 2024 | J | jnl |
Circuits Syst. Signal Process.
|
| 2023 | — | conf |
CISP-BMEI
|
| 2023 | J | jnl |
Mob. Networks Appl.
|
| 2023 | J | jnl |
Phys. Commun.
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Phys. Commun.
|
| 2022 | J | jnl |
Sensors
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2021 | — | conf |
CISP-BMEI
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
Sensors
|
| 2019 | — | conf |
WCSP
|
| 2006 | J | jnl |
Wirel. Pers. Commun.
|