| 2025 |
— |
conf |
EuCNC/6G Summit
Kumar Sai Bondada, Usama Saeed, Yibin Liang, Daniel J. Jakubisin, Lingjia Liu, R. Michael Buehrer
|
| 2025 |
— |
conf |
MILCOM
Kumar Sai Bondada, Hiten Kothari, Yibin Liang, Daniel J. Jakubisin, R. Michael Buehrer
|
| 2025 |
— |
conf |
ICC Workshops
Kumar Sai Bondada, Daniel J. Jakubisin, R. Michael Buehrer
|
| 2024 |
— |
conf |
ICC
Kumar Sai Bondada, Daniel J. Jakubisin, Nishith D. Tripathi, Jeffrey H. Reed
|
| 2024 |
— |
conf |
MILCOM
Xiang Cheng, Daniel J. Jakubisin, Hanchao Yang, Kumar Sai Bondada, Nishith D. Tripathi, Yaling Yang, Gustave Anderson, Jeffrey H. Reed
|
| 2024 |
— |
conf |
MILCOM
Connor McPeak, Kumar Sai Bondada, Nishith D. Tripathi, Gus Anderson, Jeffrey H. Reed, Daniel J. Jakubisin
|
| 2024 |
— |
conf |
IEEECONF
Hanchao Yang, Michel Kulhandjian, Hovannes Kulhandjian, Daniel J. Jakubisin, Xiang Cheng, Kumar Sai Bondada, Yaling Yang
|
| 2024 |
— |
conf |
VTC Fall
Kumar Sai Bondada, Daniel J. Jakubisin, Karim A. Said, R. Michael Buehrer, Lingjia Liu
|
| 2023 |
— |
conf |
MILCOM
Kumar Sai Bondada, Xiang Cheng, Hanchao Yang, Daniel J. Jakubisin, Nishith D. Tripathi, Gus Anderson, Yaling Yang, Jeffrey H. Reed
|
| 2023 |
— |
conf |
MILCOM
Kumar Sai Bondada, Hanchao Yang, Xiang Cheng, Daniel J. Jakubisin, Nishith D. Tripathi, Gus Anderson, Yaling Yang, Jeffrey H. Reed
|
| 2023 |
— |
conf |
MILCOM
Hanchao Yang, Kumar Sai Bondada, Xiang Cheng, Daniel J. Jakubisin, Nishith D. Tripathi, Yaling Yang, Gustave Anderson, Jeffrey H. Reed
|