Kukjin Chun

13 papers B 1C 1Misc 1Journal 2Unranked 8
YearRankTypeTitle / Venue / Authors
2020 Misc conf
Multi Image Depth from Defocus Network with Boundary Cue for Dual Aperture Camera.
ICASSP
Gwangmo Song, Yumee Kim, Kukjin Chun, Kyoung Mu Lee
2019 B conf
Lensless Imaging Sensor Kit for Sperm Counting with Microfluidic Chip.
SAS
Young Jae Kim, Kukjin Chun
2019 — conf
Novel Sperm Sorting Microfluidic Chip With Feedback Channel and Vertical Orientation.
IEEE SENSORS
Young Jae Kim, Kukjin Chun
2019 — conf
Plano-Convex Lens Fabrication for Distance Sensor based on Single Vision.
ICEIC
Yumee Kim, Kukjin Chun
2018 C conf
Tunable Aperture with Single layer Blades Actuated by Thermal Expansion of Silicon Beams.
TENCON
Chong Ho Hong, Kukjin Chun
2017 — conf
Tunable aperture controlled by thermal expansion of copper beams.
AFRICON
Keewoong Haan, Kukjin Chun
2013 — conf
Cantilever arrayed blood pressure sensor for arterial applanation tonometry.
NEMS
Byeungleul Lee, JinWoo Jeong, Chan-Seob Cho, Jinseok Kim, Bonghwan Kim, Hyeon Cheol Kim, Kukjin Chun
2013 — conf
Implantable CNT-based sensor for chondroitin sulfate proteoglycans detection of glial scar after spinal cord injury.
NEMS
JinWoo Jeong, Sehwan Kim, Jinseok Kim, Kukjin Chun
2011 J jnl
A 2x2 MIMO Tri-Band Dual-Mode Direct-Conversion CMOS Transceiver for Worldwide WiMAX/WLAN Applications.
IEEE J. Solid State Circuits
Kyoohyun Lim, Sunki Min, Sang-Hoon Lee, Jaewoo Park, Kisub Kang, Hwahyeong Shin, Hyunchul Shim, Sechang Oh, Sungho Kim, Jong-Ryul Lee, Changsik Yoo, Kukjin Chun
2010 J jnl
A 2.3GHz linearized CMOS power amplifier with AM-AM and AM-PM distortion correction.
IEICE Electron. Express
Hyunjin Yoo, Donghyun Baek, Kukjin Chun, Yun Seong Eo
2010 — conf
A 2×2 MIMO tri-band dual-mode CMOS transceiver for worldwide WiMAX/WLAN applications.
ESSCIRC
Kyoohyun Lim, Sunki Min, Sanghoon Lee, Jaewoo Park, Kisub Kang, Hwahyeong Shin, Hyunchul Shim, Sechang Oh, Sungho Kim, Jong-Ryul Lee, Changsik Yoo, Kukjin Chun
2006 — conf
Realistic computational modeling for hybrid biopolymer microcantilevers.
EMBC
Jinseok Kim, Jungyul Park, Suk-Kyu Ryu, Jeongeun Baek, Sewan Park, Hyeon Cheol Kim, Kukjin Chun, Sukho Park
2006 — conf
Wafer Level Package Using Polymer Bonding of Thick SU-8 Photoresist.
ICMENS
Kyounghwan Na, Il-Hwan Kim, Eunsung Lee, Hyeon Cheol Kim, Yong-Hwan Lee, Kukjin Chun