Kuan-Neng Chen

43 papers C 4Journal 12Unranked 26

Year	Rank	Type	Title / Venue / Authors
2025	J	`jnl`	Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I. IEEE J. Emerg. Sel. Topics Circuits Syst. Qinfen Hao, Kuan-Neng Chen, Sandeep Kumar Goel, Hai Li, Erik Jan Marinissen
2025	J	`jnl`	Guest Editorial: 2.5-D/3-D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part II. IEEE J. Emerg. Sel. Topics Circuits Syst. Qinfen Hao, Kuan-Neng Chen, Sandeep Kumar Goel, Hai Li, Erik Jan Marinissen
2025	J	`jnl`	Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset. IEEE J. Emerg. Sel. Topics Circuits Syst. Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Ching-Iang Li, Yung-Sheng Chang, Ming-Ji Dai, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, Kuan-Neng Chen, Po-Tsang Huang
2024	—	`conf`	3DIC with Stacked FinFET, Inter-Level Metal, and Field-Size (25×33mm VLSI Technology and Circuits Bo-Jheng Shih, Yu-Ming Pan, Hao-Tung Chung, Chieh-Ling Lee, I-Chun Hsieh, Nein-Chih Lin, Chih-Chao Yang, Po-Tsang Huang, Hung-Ming Chen, Chiao-Yen Wang, Huan-Yu Chiu, Huang-Chung Cheng, Chang-Hong Shen, Wen-Fa Wu, Tuo-Hung Hou, Kuan-Neng Chen, Chenming Hu
2024	—	`conf`	Cost-Effective Low-Temperature Hybrid Bonding Using Layer Transfer Technology. 3DIC Yu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang Hsiung, Yuan-Chiu Huang, Kuan-Neng Chen
2024	—	`conf`	Low-Temperature Adhesive Hybrid Bonding Technology with Novel Area-Selective Passivation Layer. 3DIC Tzu-Han Sun, Yu-Lun Liu, Chun-Ta Li, Wen-Tzu Tsai, Mu-Ping Hsu, Kuan-Neng Chen
2024	—	`conf`	Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology. VLSI Technology and Circuits Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, Kuan-Neng Chen, Po-Tsang Huang
2022	—	`conf`	An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. VLSI Technology and Circuits Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu
2022	—	`conf`	Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging. VLSI Technology and Circuits Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen
2019	—	`conf`	Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. 3DIC Yi-Chieh Tsai, Chia-Hsuan Lee, Kuan-Neng Chen
2019	—	`conf`	Low Temperature Cu to Cu Direct Bonding below 150 °C with Au Passivation Layer. 3DIC Demin Liu, Po-Chih Chen, Yi-Chieh Tsai, Kuan-Neng Chen
2019	—	`conf`	Low-Temperature Wafer-Level Metal Bonding with Gold Thin Film at 100 °C. 3DIC Po-Chih Chen, Demin Liu, Kuan-Neng Chen
2019	—	`conf`	Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba
2017	C	`conf`	An implantable 128-channel wireless neural-sensing microsystem using TSV-embedded dissolvable μ-needle array and flexible interposer. ISCAS Po-Tsang Huang, Yu-Chieh Huang, Shang-Lin Wu, Yu-Chen Hu, Ming-Wei Lu, Ting-Wei Sheng, Fung-Kai Chang, Chun-Pin Lin, Nien-Shang Chang, Hung-Lieh Chen, Chi-Shi Chen, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou
2017	J	`jnl`	Ultrahigh-Density 256-Channel Neural Sensing Microsystem Using TSV-Embedded Neural Probes. IEEE Trans. Biomed. Circuits Syst. Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou
2016	C	`conf`	An ultra-high-density 256-channel/25mm2 neural sensing microsystem using TSV-embedded neural probes. ISCAS Yu-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Yu-Chen Hu, Yan-Huei You, Ming Chen, Yan-Yu Huang, Hsiao-Chun Chang, Yen-Han Lin, Jeng-Ren Duann, Tzai-Wen Chiu, Wei Hwang, Kuan-Neng Chen, Ching-Te Chuang, Jin-Chern Chiou
2016	—	`conf`	Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration. 3DIC Yu-Tao Yang, Yu-Chen Hu, Kuan-Neng Chen
2016	—	`conf`	The influence of device morphology on wafer-level bonding with polymer-coated layer. 3DIC Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
2015	—	`conf`	An ultra-fast temporary bonding and release process based on thin photolysis polymer in 3D integration. 3DIC Tsung-Yen Tsai, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen
2015	—	`conf`	Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 3DIC Chuan-An Cheng, Ryuichi Sugie, Tomoyuki Uchida, Kou-Hua Chen, Chi-Tsung Chiu, Kuan-Neng Chen
2014	—	`conf`	18.6 2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications. ISSCC Po-Tsang Huang, Lei-Chun Chou, Teng-Chieh Huang, Shang-Lin Wu, Tang-Shuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching-Te Chuang, Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu, Ming-Hsiang Cheng, Yueh-lung Lin, Ho-Ming Tong
2014	J	`jnl`	2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications. IEEE Trans. Biomed. Circuits Syst. Po-Tsang Huang, Shang-Lin Wu, Yu-Chieh Huang, Lei-Chun Chou, Teng-Chieh Huang, Tang-Hsuan Wang, Yu-Rou Lin, Chuan-An Cheng, Wen-Wei Shen, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Ho-Ming Tong
2014	C	`conf`	Energy-efficient configurable discrete wavelet transform for neural sensing applications. ISCAS Tang-Hsuan Wang, Po-Tsang Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang
2014	—	`conf`	Energy-efficient low-noise 16-channel analog-front-end circuit for bio-potential acquisition. VLSI-DAT Shang-Lin Wu, Po-Tsang Huang, Teng-Chieh Huang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang
2013	—	`conf`	Area-power-efficient 11-bit SAR ADC with delay-line enhanced tuning for neural sensing applications. BioCAS Teng-Chieh Huang, Po-Tsang Huang, Shang-Lin Wu, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Ching-Te Chuang, Wei Hwang
2013	—	`conf`	Low temperature (<180 °C) bonding for 3D integration. 3DIC Yan-Pin Huang, Ruoh-Ning Tzeng, Yu-San Chien, Ming-Shaw Shy, Teu-Hua Lin, Kuo-Hua Chen, Ching-Te Chuang, Wei Hwang, Chi-Tsung Chiu, Ho-Ming Tong, Kuan-Neng Chen
2013	C	`conf`	Near-/Sub-Vth process, voltage, and temperature (PVT) sensors with dynamic voltage selection. ISCAS Ming-Hung Chang, Shang-Yuan Lin, Pei-Chen Wu, Olesya Zakoretska, Ching-Te Chuang, Kuan-Neng Chen, Chen-Chao Wang, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang
2013	J	`jnl`	Reliability of key technologies in 3D integration. Microelectron. Reliab. Cheng-Ta Ko, Kuan-Neng Chen
2013	—	`conf`	Through-silicon-via-based double-side integrated microsystem for neural sensing applications. ISSCC Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong
2012	J	`jnl`	BCB-to-oxide bonding technology for 3D integration. Microelectron. Reliab. S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen
2012	J	`jnl`	Low temperature bonding technology for 3D integration. Microelectron. Reliab. Cheng-Ta Ko, Kuan-Neng Chen
2012	—	`conf`	On-chip self-calibrated process-temperature sensor for TSV 3D integration. SoCC Tzu-Ting Chiang, Po-Tsang Huang, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Kuo-Hua Chen, Chi-Tsung Chiu, Ho-Ming Tong, Wei Hwang
2012	J	`jnl`	Wafer-level Cu-Cu bonding technology. Microelectron. Reliab. Ya-Sheng Tang, Yao-jen Chang, Kuan-Neng Chen
2011	—	`conf`	Cu-based bonding technology for 3D integration applications. 3DIC Kuan-Neng Chen, Z. Xu, Fei Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo
2011	J	`jnl`	Integration schemes and enabling technologies for three-dimensional integrated circuits. IET Comput. Digit. Tech. Kuan-Neng Chen, Chuan Seng Tan
2011	—	`conf`	Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen
2010	—	`conf`	Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network. 3DIC Zheng Xu, Adam Beece, Dingyou Zhang, Qianwen Chen, Kuan-Neng Chen, Kenneth Rose, Jian-Qiang Lu
2010	—	`conf`	Wafer-level 3D integration using hybrid bonding. 3DIC Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen
2010	J	`jnl`	Wafer-level bonding/stacking technology for 3D integration. Microelectron. Reliab. Cheng-Ta Ko, Kuan-Neng Chen
2008	J	`jnl`	Wafer-level 3D integration technology. IBM J. Res. Dev. Steven J. Koester, Albert M. Young, Roy R. Yu, Sampath Purushothaman, Kuan-Neng Chen, Douglas C. La Tulipe Jr., Narender Rana, Leathen Shi, Matthew R. Wordeman, Edmund J. Sprogis
2005	—	`—`	Copper wafer bonding in three-dimensional integration. Kuan-Neng Chen
2004	—	`conf`	Technology, performance, and computer-aided design of three-dimensional integrated circuits. ISPD Shamik Das, Andy Fan, Kuan-Neng Chen, Chuan Seng Tan, Nisha Checka, Rafael Reif
2002	—	`conf`	Fabrication Technologies for Three-Dimensional Integrated Circuits (invited). ISQED Rafael Reif, Andy Fan, Kuan-Neng Chen, Shamik Das