Kristof Croes

31 papers A 1Journal 9Unranked 21
YearRankTypeTitle / Venue / Authors
2025 J jnl
Novel Concept-Oriented Synthetic Data approach for Training Generative AI-Driven Crystal Grain Analysis Using Diffusion Model.
CoRR
Ahmed Sobhi Saleh, Kristof Croes, Hajdin Ceric, Ingrid De Wolf, Houman Zahedmanesh
2024 — conf
32×100 GHz WDM filter based on ultra-compact silicon rings with a high thermal tuning efficiency of 5.85 mW/π.
OFC
Qingzhong Deng, Ahmed H. El-Saeed, Alaa Elshazly, Guy Lepage, Chiara Marchese, Hakim Kobbi, Rafal Magdziak, Jeroen De Coster, Neha Singh, Marko Ersek Filipcic, Kristof Croes, Dimitrios Velenis, Maumita Chakrabarti, Peter De Heyn, Peter Verheyen, Philippe Absil, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout
2023 — conf
A pragmatic network-aware paradigm for system-level electromigration predictions at scale.
IRPS
Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes
2023 — conf
Challenges for Interconnect Reliability: From Element to System Level.
ISPD
Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes
2023 — conf
Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
IRPS
Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
2022 A conf
Analyzing the Electromigration Challenges of Computation in Resistive Memories.
ITC
Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil, Kristof Croes, Francky Catthoor
2022 — conf
Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors.
OFC
Kristof Croes, Veerle Simons, Brecht Truijen, Philippe Roussel, Koen Van Sever, Artemisia Tsiara, Jacopo Franco, Philippe Absil
2022 — conf
Degradation mechanisms in Germanium Electro-Absorption Modulators.
IRPS
Artemisia Tsiara, Alicja Lesniewska, Philippe Roussel, Srinivasan Ashwyn Srinivasan, Mathias Berciano, Marko Simicic, Marianna Pantouvaki, Joris Van Campenhout, Kristof Croes
2022 — conf
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism.
IRPS
Lin Hou, Emmanuel Chery, Kristof Croes, Davide Tierno, Soon Aik Chew, Yangyin Chen, Peter Rakbin, Eric Beyne
2022 — conf
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.
IRPS
Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu
2022 J jnl
Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil Komalan, Houman Zahedmanesh, Kristof Croes, Tommaso Marinelli, José Ignacio Gómez Pérez, Timon Evenblij, Gouri Sankar Kar, Francky Catthoor
2021 — conf
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.
SLIP
Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes
2021 — conf
Electromigration limits of copper nano-interconnects.
IRPS
Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes
2021 — conf
Reliability of Mo as Word Line Metal in 3D NAND.
IRPS
Davide Tierno, Kristof Croes, Arjun Ajaykumar, Siva Ramesh, Geert Van den Bosch, Maarten Rosmeulen
2020 — conf
Metal reliability mechanisms in Ruthenium interconnects.
IRPS
Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes
2020 — conf
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects.
IRPS
Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor
2019 — conf
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.
IRPS
Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes
2019 — conf
Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects.
IRPS
Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor
2018 — conf
Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.
IRPS
Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf
2018 — conf
Silicon Photonics for 56G NRZ Optical Interconnects.
OFC
Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil
2018 — conf
Stress mitigation of 3D-stacking/packaging induced stresses.
IRPS
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne
2018 — conf
TSV process-induced MOS reliability degradation.
IRPS
Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes
2018 — conf
The first observation of p-type electromigration failure in full ruthenium interconnects.
IRPS
Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes
2017 J jnl
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.
Microelectron. Reliab.
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei
2016 J jnl
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.
Microelectron. Reliab.
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
2016 J jnl
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.
Microelectron. Reliab.
Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei
2016 J jnl
Reliability Challenges Related to TSV Integration and 3-D Stacking.
IEEE Des. Test
Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne
2015 J jnl
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.
Microelectron. Reliab.
Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf
2014 J jnl
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias.
Microelectron. Reliab.
Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes
2008 — conf
A tool flow for predicting system level timing failures due to interconnect reliability degradation.
ACM Great Lakes Symposium on VLSI
Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor
2008 J jnl
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle.
Microelectron. Reliab.
Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tökei