| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2023 | J | jnl |
Int. J. Multim. Inf. Retr.
|
| 2023 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2023 | J | jnl |
Artif. Intell. Rev.
|
| 2022 | J | jnl |
ACM Trans. Asian Low Resour. Lang. Inf. Process.
|
| 2022 | J | jnl |
Wirel. Pers. Commun.
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
IEEE Consumer Electron. Mag.
|
| 2021 | — | conf |
BDA
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2019 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2018 | J | jnl |
Multim. Tools Appl.
|
| 2018 | J | jnl |
Multim. Tools Appl.
|
| 2018 | J | jnl |
IEEE Trans. Multim.
|
| 2018 | — | conf |
RAIT
|
| 2017 | — | conf |
ICCCT
|
| 2017 | — | conf |
ICVIP
|
| 2017 | — | conf |
ICCCT
|
| 2017 | — | conf |
CVIP (2)
|
| 2017 | — | conf |
CVIP (1)
|
| 2017 | — | conf |
ICCCT
|
| 2017 | — | conf |
PReMI
|
| 2017 | — | conf |
ICAPR
|
| 2017 | — | conf |
CVIP (1)
|
| 2016 | — | conf |
SITIS
|