| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | B | conf |
VMCAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | — | conf |
ICIMMI
|
| 2023 | — | conf |
ICIMMI
|
| 2023 | — | conf |
ICIMMI
|
| 2023 | A* | conf |
DAC
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | C | conf |
FMICS
|
| 2021 | J | jnl |
CoRR
|
| 2021 | A* | conf |
DAC
|
| 2021 | J | jnl |
J. Hardw. Syst. Secur.
|
| 2021 | J | jnl |
CoRR
|
| 2020 | — | conf |
EFFORT: Enhancing Energy Efficiency and Error Resilience of a Near-Threshold Tensor Processing Unit.
ASP-DAC
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2019 | J | jnl |
J. Low Power Electron.
|
| 2019 | A* | conf |
DAC
|
| 2019 | A | conf |
Predicting Critical Warps in Near-Threshold GPGPU Applications using a Dynamic Choke Point Analysis.
DATE
|
| 2019 | C | conf |
FMICS
|
| 2019 | J | jnl |
J. Hardw. Syst. Secur.
|
| 2018 | A | conf |
ISLPED
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2018 | A | conf |
ISLPED
|
| 2018 | J | jnl |
Microprocess. Microsystems
|
| 2018 | A | conf |
DATE
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | A | conf |
DATE
|
| 2017 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2017 | J | jnl |
J. Hardw. Syst. Secur.
|
| 2017 | J | jnl |
J. Low Power Electron.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | A* | conf |
DAC
|
| 2016 | A | conf |
DATE
|
| 2016 | A* | conf |
DAC
|
| 2016 | A* | conf |
DAC
|
| 2015 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2015 | A* | conf |
DAC
|
| 2015 | J | jnl |
J. Low Power Electron.
|
| 2015 | — | conf |
NOCS
|
| 2015 | A | conf |
ISLPED
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | A | conf |
DATE
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | — | conf |
ISQED
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | A* | conf |
DAC
|
| 2014 | Misc | conf |
CODES+ISSS
|
| 2013 | C | conf |
ICCD
|
| 2013 | J | jnl |
Microelectron. Reliab.
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | A* | conf |
DAC
|
| 2013 | A* | conf |
DAC
|
| 2013 | A* | conf |
DAC
|
| 2013 | C | conf |
ICCD
|
| 2013 | A | conf |
DATE
|
| 2012 | A | conf |
DATE
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2012 | C | conf |
ICCD
|
| 2012 | A | conf |
ISLPED
|
| 2012 | C | conf |
ICCD
|
| 2012 | — | conf |
ISQED
|
| 2012 | A* | conf |
DAC
|
| 2012 | — | conf |
ISQED
|
| 2012 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2012 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2012 | A* | conf |
DAC
|
| 2011 | Misc | conf |
VLSI Design
|
| 2011 | — | conf |
ISQED
|
| 2011 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2011 | J | jnl |
Microprocess. Microsystems
|
| 2011 | A | conf |
ICCAD
|
| 2011 | — | conf |
ISQED
|
| 2011 | J | jnl |
J. Low Power Electron.
|
| 2011 | — | conf |
ISQED
|
| 2011 | A | conf |
DATE
|
| 2010 | J | jnl |
J. Low Power Electron.
|
| 2010 | — | conf |
ISQED
|
| 2010 | C | conf |
ICCD
|
| 2010 | Misc | conf |
VLSI Design
|
| 2009 | J | jnl |
ACM SIGOPS Oper. Syst. Rev.
|
| 2009 | A* | conf |
ASPLOS
|
| 2008 | A* | conf |
ASPLOS
|
| 2007 | B | conf |
PACT
|
| 2006 | A* | conf |
ASPLOS
|
| 2006 | B | conf |
PACT
|