| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
Informatics
|
| 2024 | Misc | conf |
ICMLC
|
| 2023 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2023 | C | conf |
ICCE
|
| 2023 | — | conf |
HCI (26)
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
SICE
|
| 2021 | — | conf |
ABC
|
| 2021 | C | conf |
ICCE
|
| 2021 | — | conf |
ICA
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
UbiComp/ISWC Adjunct
|
| 2019 | — | conf |
HCI (5)
|
| 2019 | — | ch. |
Disaster Robotics
|
| 2018 | A* | conf |
ICRA
|
| 2018 | — | conf |
ANZCC
|
| 2018 | C | conf |
FIE
|
| 2018 | — | conf |
SCDM
|
| 2018 | J | jnl |
Robotics
|
| 2017 | — | conf |
NTCIR
|
| 2016 | B | conf |
IVA
|
| 2016 | J | jnl |
IEICE Trans. Electron.
|
| 2015 | — | conf |
IIAI-AAI
|
| 2015 | B | conf |
PIMRC
|
| 2015 | — | conf |
IIAI-AAI
|
| 2014 | — | conf |
Customer Behavior Analysis on after Getting Off the Train Based on Usage Histories of Smart IC Card.
IIAI-AAI
|
| 2014 | — | conf |
COOL Chips
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2013 | C | conf |
IAS
|
| 2013 | — | conf |
RoMoCo
|