Klaus-Dieter Lang

19 papers A 1C 2Journal 11Unranked 5
YearRankTypeTitle / Venue / Authors
2021 — conf
Piezoresistive 4H-Silicon Carbide (SiC) pressure sensor.
IEEE SENSORS
Piotr Mackowiak, Kolja Erbacher, Manuel Baeuscher, Michael Schiffer, Klaus-Dieter Lang, Martin Schneider-Ramelow, Ha-Duong Ngo
2019 C conf
Investigation of IDC Structures for Graphene Based Biosensors Using Low Frequency EIS Method.
DeSE
Manuel Baeuscher, Oliver Reinicke, Matthäus Henke, Piotr Mackowiak, Michael Schiffer, Martin Schneider-Ramelow, Klaus-Dieter Lang, Ha-Duong Ngo
2019 C conf
Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.
DeSE
Piotr Mackowiak, Samer Al-Magazachi, Klaus-Dieter Lang, Kolja Erbacher, Manuel Bäuscher, Ha-Duong Ngo, Kai Zoschke, Michael Schiffer
2018 J jnl
Corrosion behaviour of sintered silver under maritime environmental conditions.
Microelectron. Reliab.
Elisabeth Kolbinger, Stefan Wagner, Astrid Gollhardt, Olaf Rämer, Klaus-Dieter Lang
2018 — conf
Optimization Parameters for Laser-induced Forward Transfer of Al and Cu on Si-wafer Substrate.
PHOTOPTICS
Mohammad Hossein Azhdast, Hans Joachim Eichler, Klaus-Dieter Lang, Veronika Glaw
2017 J jnl
Laser cuts increase the reliability of heavy-wire bonds and enable on-line process control using thermography.
Microelectron. Reliab.
A. Middendorf, A. Grams, S. Janzen, Klaus-Dieter Lang, Olaf Wittler
2017 A conf
The roadmap for development of piezoresistive micro mechanical sensors for harsh environment applications.
ICST
Ha-Duong Ngo, Piotr Mackowiak, Niels Grabbert, Thomas Weiland, Xiaodong Hu, Martin Schneider-Ramelow, Oswin Ehrmann, Klaus-Dieter Lang
2016 J jnl
A WSi-WSiN-Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems.
Micromachines
Ha-Duong Ngo, Biswajit Mukhopadhyay, Piotr Mackowiak, Kevin Kröhnert, Oswin Ehrmann, Klaus-Dieter Lang
2016 J jnl
High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach.
Microelectron. Reliab.
J. Thambi, Ulrich A. W. Tetzlaff, Andreas Schiessl, Klaus-Dieter Lang, M. Waltz
2016 J jnl
Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars.
Microelectron. Reliab.
Michael Krüger, Stefan Straube, Andreas Middendorf, Daniel Hahn, T. Dobs, Klaus-Dieter Lang
2015 J jnl
Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments.
Sensors
Ha-Duong Ngo, Biswajit Mukhopadhyay, Oswin Ehrmann, Klaus-Dieter Lang
2015 J jnl
Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding.
Microelectron. Reliab.
Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Martin Schneider-Ramelow, Klaus-Dieter Lang
2015 — conf
From fan-out wafer to fan-out panel level packaging.
ECCTD
Tanja Braun, K.-F. Becker, S. Raatz, V. Bader, Jörg Bauer, Rolf Aschenbrenner, S. Voges, Tina Thomas, Ruben Kahle, Klaus-Dieter Lang
2015 J jnl
Microstructural evolution of ultrasonic-bonded aluminum wires.
Microelectron. Reliab.
Marian Sebastian Broll, Ute Geissler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Klaus-Dieter Lang
2014 J jnl
Improving the FE simulation of molded packages using warpage measurements.
Microelectron. Reliab.
Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang
2014 — conf
Low-loss telecom wavelength board-level optical interconnects in thin glass panels by ion-exchange waveguide technology.
ECOC
Lars Brusberg, Christian Herbst, Marcel Neitz, Henning Schröder, Klaus-Dieter Lang
2014 J jnl
The influence of liners with Ti, Ta or Ru finish on thin Cu films.
Microelectron. Reliab.
David Gross, Sabine Haag, Martin Schneider-Ramelow, Klaus-Dieter Lang
2013 J jnl
Transport of moisture at epoxy-SiO
Microelectron. Reliab.
O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang
2012 — conf
Development of Rechargeable Micro Batteries Based on Micro Channel Structures.
GreenCom
R. Hahn, K. Hoppner, K. Marquardt, M. Eisenreich, M. Ferch, M. Wilke, Klaus-Dieter Lang