Kirsten Weide-Zaage

30 papers Journal 28Unranked 2
YearRankTypeTitle / Venue / Authors
2023 — conf
Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology.
ARC
Eike Trumann, Gia Bao Thieu, Johannes Schmechel, Kirsten Weide-Zaage, Katharina Schmidt, Dorian Hagenah, Guillermo Payá Vayá
2017 J jnl
Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation).
Microelectron. Reliab.
Kirsten Weide-Zaage
2016 J jnl
Effects of salt spray test on lead-free solder alloy.
Microelectron. Reliab.
Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage
2016 J jnl
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization.
Microelectron. Reliab.
Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai
2015 J jnl
Dynamical IMC-growth calculation.
Microelectron. Reliab.
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
2015 J jnl
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys.
Microelectron. Reliab.
Mohd Faizul Mohd Sabri, Nor Ilyana Muhd Nordin, Suhana Mohd Said, Nur Aishah Aminah Mohd Amin, Hamzah Arof, Iswadi Jauhari, Roziana Ramli, Kirsten Weide-Zaage
2015 J jnl
Electro- and thermomigration induced Cu
Microelectron. Reliab.
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
2014 J jnl
Degradation behavior in upstream/downstream via test structures.
Microelectron. Reliab.
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Christian Kovács
2014 J jnl
Evaluation new corner stress relief structure layout for high robust metallization.
Microelectron. Reliab.
Verena Hein, Jörg Kludt, Kirsten Weide-Zaage
2014 J jnl
Qualification procedure for moisture in embedded capacitors.
Microelectron. Reliab.
Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp
2014 J jnl
Reliability of Wafer Level Chip Scale Packages.
Microelectron. Reliab.
R. T. H. Rongen, R. Roucou, P. J. vd Wel, F. C. Voogt, F. Swartjes, Kirsten Weide-Zaage
2014 J jnl
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core.
Microelectron. Reliab.
Kirsten Weide-Zaage, J. Schlobohm, R. T. H. Rongen, F. C. Voogt, R. Roucou
2014 — conf
Simulation in 3D integration and TSV.
LASCAS
Kirsten Weide-Zaage, Aymen Moujbani, Jörg Kludt
2013 J jnl
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects.
Microelectron. Reliab.
Aymen Moujbani, Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein, Lutz Meinshausen
2013 J jnl
Dynamic simulation of octahedron slotted metal structures.
Microelectron. Reliab.
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein
2013 J jnl
Electro- and thermomigration-induced IMC formation in SnAg
Microelectron. Reliab.
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
2012 J jnl
A design for robust wide metal tracks.
Microelectron. Reliab.
Markus Ackermann, Verena Hein, Christian Kovács, Kirsten Weide-Zaage
2012 J jnl
Electro- and thermo-migration induced failure mechanisms in Package on Package.
Microelectron. Reliab.
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
2012 J jnl
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.
Microelectron. Reliab.
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage
2012 J jnl
Simulation of the influence of TiAl
Microelectron. Reliab.
Jörg Kludt, Kirsten Weide-Zaage, Markus Ackermann, Verena Hein
2011 J jnl
Influence of air gaps on the thermal-electrical-mechanical behavior of a copper metallization.
Microelectron. Reliab.
Irina Bauer, Kirsten Weide-Zaage, Lutz Meinshausen
2011 J jnl
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.
Microelectron. Reliab.
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
2009 J jnl
Investigation of stress distribution in via bottom of Cu-via structures with different via form by means of submodeling.
Microelectron. Reliab.
Joharsyah Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel
2008 J jnl
Determination of migration effects in Cu-via structures with respect to process-induced stress.
Microelectron. Reliab.
Kirsten Weide-Zaage, Jiani Zhao, Joharsyah Ciptokusumo, Oliver Aubel
2008 J jnl
Simulation of migration effects in nanoscaled copper metallizations.
Microelectron. Reliab.
Kirsten Weide-Zaage, Farzan Kashanchi, Oliver Aubel
2007 J jnl
Dynamic void formation in a DD-copper-structure with different metallization geometry.
Microelectron. Reliab.
Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont
2005 J jnl
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations.
Microelectron. Reliab.
Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont
2004 J jnl
How to study delamination in plastic encapsulated devices.
Microelectron. Reliab.
Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto
2003 J jnl
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures.
Microelectron. Reliab.
David Dalleau, Kirsten Weide-Zaage, Yves Danto
2001 J jnl
Three-Dimensional Voids Simulation in chip Metallization Structures: a Contribution to Reliability Evaluation.
Microelectron. Reliab.
David Dalleau, Kirsten Weide-Zaage