Kimihiro Yamanaka

14 papers B 1Journal 7Unranked 6
YearRankTypeTitle / Venue / Authors
2024 J jnl
Classification of visual attention by microsaccades using machine learning.
Int. J. Biom.
Soichiro Yokoo, Nobuyuki Nishiuchi, Kimihiro Yamanaka
2021 — conf
Emotion Estimating Method by Using Voice and Facial Expression Parameters.
CISIM
Kimihiro Yamanaka
2020 J jnl
Classification of Visual Attention Level During Target Gazing Using Microsaccades.
Trans. Comput. Sci.
Soichiro Yokoo, Nobuyuki Nishiuchi, Kimihiro Yamanaka
2020 B conf
Proposal for Visual Attention Level Based on Microsaccades after Saccades.
SMC
Soichiro Yokoo, Nobuyuki Nishiuchi, Kimihiro Yamanaka
2018 — conf
Quantitative Usability Testing Based on Eye Fixation-Related Potentials.
HCI (28)
Kimihiro Yamanaka
2016 — conf
Relation Between Mental Workload and Useful Field of View in Elderly.
HCI (26)
Kimihiro Yamanaka, Kohei Shioda, Mitsuyuki Kawakami
2015 J jnl
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density.
Microelectron. Reliab.
Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma
2014 — conf
Basic Research on the Factors Influencing Perception of Texture from Images.
HCI (12)
Kimihiro Yamanaka, Kazuki Nagamura
2013 — conf
Measurement of Useful Field of View during Ocular Following Response.
HCI (28)
Kimihiro Yamanaka, Atsushi Minochi
2011 J jnl
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
Microelectron. Reliab.
Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima
2010 J jnl
Biometric verification using the motion of fingers: a combination of physical and behavioural biometrics.
Int. J. Biom.
Nobuyuki Nishiuchi, Shungo Komatsu, Kimihiro Yamanaka
2008 — conf
A Study of Visibility Evaluation for the Combination of Character Color and Background Color on a Web Page.
SSIRI
Nobuyuki Nishiuchi, Kimihiro Yamanaka, Kunie Beppu
2008 J jnl
Hybrid fingerprint authentication using artifact-metrics.
Int. J. Biom.
Miki Yamagishi, Nobuyuki Nishiuchi, Kimihiro Yamanaka
2007 J jnl
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system.
Microelectron. Reliab.
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma