| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | J | jnl |
Int. J. Inf. Sec.
|
| 2025 | J | jnl |
Circuits Syst. Signal Process.
|
| 2025 | J | jnl |
Int. J. Mach. Learn. Cybern.
|
| 2025 | J | jnl |
J. Supercomput.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | J | jnl |
Circuits Syst. Signal Process.
|
| 2024 | J | jnl |
Circuits Syst. Signal Process.
|
| 2023 | J | jnl |
J. Signal Process. Syst.
|
| 2023 | J | jnl |
IET Circuits Devices Syst.
|
| 2023 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2022 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | — | conf |
ISMVL
|
| 2021 | Misc | conf |
CSICC
|
| 2020 | — | conf |
GHTC
|
| 2020 | — | conf |
GHTC
|
| 2019 | J | jnl |
IET Circuits Devices Syst.
|
| 2012 | J | jnl |
Autom.
|
| 2010 | — | conf |
CDC
|
| 2010 | — | conf |
Three-Dimensional Image Processing (3DIP) and Applications
|
| 2010 | — | conf |
EUSIPCO
|