Khanh N. Dang - RankMe

47 papers B 1Journal 25Unranked 19

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	ApproxiMorph: Energy-Efficient Neuromorphic System With Layer-Wise Approximation of Spiking Neural Networks and 3-D-Stacked SRAM. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Ryoji Kobayashi, Ngo-Doanh Nguyen, Abderazek Ben Abdallah, Nguyen Anh Vu Doan, Khanh N. Dang
2026	J	`jnl`	Edge-Driven Dynamic Two-Tier Blockchain for Energy Trading in Vehicle-to-Grid Networks. IEEE Trans. Veh. Technol. Zhishang Wang, Yuxiao Liang, Achraf Ben Ahmed, Khanh N. Dang, Abderazek Ben Abdallah
2026	J	`jnl`	Energy-Efficient Izhikevich Neuron Design Using Approximate CORDIC-Based Multipliers for Low-Power Neuromorphic Hardware. IEEE Access van-Vu Luyen, Thanh-Dat Nguyen, Quang-Thai Pham, Duy-Anh Nguyen, Khanh N. Dang, Van-Hai Pham, Thanh-Toan Dao
2025	—	`conf`	Analytical Modeling of Task Allocation for Distributed Anthropomorphic Robots in Mission-Critical Environments. MCSoC Zhishang Wang, Yassine Khedher, Khanh N. Dang, Michael Cohen, Abderazek Ben Abdallah
2025	—	`conf`	Evolutionary Algorithm for STDP-Based Spiking Neural Network Model Compression. MCSoC Hanyu Yuga, Zhishang Wang, Khanh N. Dang
2025	—	`conf`	FSPC: A Lossy Spike Compression Through Correlated-AER Merging in Spiking Neural Networks. MCSoC Satvik Ganesh, Hanyu Yuga, Zhishang Wang, Khanh N. Dang
2025	—	`book`	Neuromorphic Computing Principles and Organization, Second Editiontion Abderazek Ben Abdallah, Khanh N. Dang
2024	J	`jnl`	A light-weight neuromorphic controlling clock gating based multi-core cryptography platform. Microprocess. Microsystems Pham-Khoi Dong, Khanh N. Dang, Duy-Anh Nguyen, Xuan-Tu Tran
2024	J	`jnl`	BTSAM: Balanced Thermal-State-Aware Mapping Algorithms and Architecture for 3D-NoC-Based Neuromorphic Systems. IEEE Access Mohamed Maatar, Zhishang Wang, Khanh N. Dang, Abderazek Ben Abdallah
2024	—	`conf`	Energy-Efficient Spiking Neural Networks Using Approximate Neuron Circuits and 3D Stacking Memory. MCSoC Ryoji Kobayashi, Ngo-Doanh Nguyen, Nguyen Anh Vu Doan, Khanh N. Dang
2024	—	`conf`	EnsembleSTDP: Distributed in-situ Spike Timing Dependent Plasticity Learning in Spiking Neural Networks. MCSoC Hanyu Yuga, Khanh N. Dang
2023	—	`conf`	A Novel Yield Improvement Approach for 3D Stacking Neuromorphic Architecture. MCSoC Ngo-Doanh Nguyen, Khanh N. Dang
2023	J	`jnl`	An In-Situ Dynamic Quantization With 3D Stacking Synaptic Memory for Power-Aware Neuromorphic Architecture. IEEE Access Ngo-Doanh Nguyen, Xuan-Tu Tran, Abderazek Ben Abdallah, Khanh N. Dang
2023	—	`conf`	Fault Recovery in Spiking Neural Networks Through Target and Selection of Faulty Neurons for 3D Spiking Neuromorphic Processors. ICKII Williams Yohanna Yerima, Khanh N. Dang, Abderazek Ben Abdallah
2023	J	`jnl`	Fault-Tolerant Spiking Neural Network Mapping Algorithm and Architecture to 3D-NoC-Based Neuromorphic Systems. IEEE Access Williams Yohanna Yerima, Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah
2023	J	`jnl`	HeterGenMap: An Evolutionary Mapping Framework for Heterogeneous NoC-Based Neuromorphic Systems. IEEE Access Khanh N. Dang, Nguyen Anh Vu Doan, Ngo-Doanh Nguyen, Abderazek Ben Abdallah
2023	—	`conf`	Interlinked Chain Method for Blockchain-Based Collaborative Learning in Vehicular Networks. MCSoC Zhishang Wang, Khanh N. Dang, Abderazek Ben Abdallah
2023	J	`jnl`	Power-Aware Neuromorphic Architecture With Partial Voltage Scaling 3-D Stacking Synaptic Memory. IEEE Trans. Very Large Scale Integr. Syst. Ngo-Doanh Nguyen, Akram Ben Ahmed, Abderazek Ben Abdallah, Khanh N. Dang
2023	J	`jnl`	R-MaS3N: Robust Mapping of Spiking Neural Networks to 3D-NoC-Based Neuromorphic Systems for Enhanced Reliability. IEEE Access Williams Yohanna Yerima, Khanh N. Dang, Abderazek Ben Abdallah
2022	J	`jnl`	A low-power, high-accuracy with fully on-chip ternary weight hardware architecture for Deep Spiking Neural Networks. Microprocess. Microsystems Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, Francesca Iacopi
2022	B	`conf`	Efficient Pneumonia Detection Method and Implementation in Chest X-ray Images Based on a Neuromorphic Spiking Neural Network. ICCCI Tomohide Fukuchi, Ogbodo Mark Ikechukwu, Jiangkun Wang, Khanh N. Dang, Abderazek Ben Abdallah
2022	J	`jnl`	HotCluster: A Thermal-Aware Defect Recovery Method for Through-Silicon-Vias Toward Reliable 3-D ICs Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2022	J	`jnl`	MigSpike: A Migration Based Algorithms and Architecture for Scalable Robust Neuromorphic Systems. IEEE Trans. Emerg. Top. Comput. Khanh N. Dang, Nguyen Anh Vu Doan, Abderazek Ben Abdallah
2022	—	`book`	Neuromorphic Computing Principles and Organization Abderazek Ben Abdallah, Khanh N. Dang
2021	—	`conf`	Energy-Efficient Spike-Based Scalable Architecture for Next-Generation Cognitive AI Computing Systems. UNet Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah
2021	J	`jnl`	On the Design of a Fault-Tolerant Scalable Three Dimensional NoC-Based Digital Neuromorphic System With On-Chip Learning. IEEE Access Ogbodo Mark Ikechukwu, Khanh N. Dang, Abderazek Ben Abdallah
2020	J	`jnl`	A Non-Blocking Non-Degrading Multiple Defects Link Testing Method for 3D-Networks-on-Chip. IEEE Access Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2020	J	`jnl`	A Thermal-Aware On-Line Fault Tolerance Method for TSV Lifetime Reliability in 3D-NoC Systems. IEEE Access Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2020	—	`conf`	A lightweight Max-Pooling method and architecture for Deep Spiking Convolutional Neural Networks. APCCAS Duy-Anh Nguyen, Xuan-Tu Tran, Khanh N. Dang, Francesca Iacopi
2020	J	`jnl`	A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems. CoRR Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
2020	J	`jnl`	An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. CoRR Khanh N. Dang, Abderazek Ben Abdallah
2020	—	`conf`	Light-Weight Spiking Neuron Processing Core for Large-Scale 3D-NoC Based Spiking Neural Network Processing Systems. BigComp Mark Ogbodo, The Vu, Khanh N. Dang, Abderazek Ben Abdallah
2020	J	`jnl`	Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems. CoRR Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
2020	J	`jnl`	Report on power, thermal and reliability prediction for 3D Networks-on-Chip. CoRR Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2020	J	`jnl`	Scalable Design Methodology and Online Algorithm for TSV-Cluster Defects Recovery in Highly Reliable 3D-NoC Systems. IEEE Trans. Emerg. Top. Comput. Khanh N. Dang, Akram Ben Ahmed, Yuichi Okuyama, Abderazek Ben Abdallah
2020	J	`jnl`	Soft-Error and Hard-fault Tolerant Architecture and Routing Algorithm for Reliable 3D-NoC Systems. CoRR Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah
2020	J	`jnl`	TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems. IEEE Trans. Very Large Scale Integr. Syst. Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2019	—	`conf`	2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. APCCAS Khanh N. Dang, Michael Conrad Meyer, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2019	—	`conf`	An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems. IINTEC Khanh N. Dang, Abderazek Ben Abdallah
2019	—	`conf`	An on-Communication Multiple-TSV Defects Detection and Localization for Real-Time 3D-ICs. MCSoC Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran
2019	—	`conf`	TSV-IaS: Analytic Analysis and Low-Cost Non-Preemptive on-Line Detection and Correction Method for TSV Defects. ISVLSI Khanh N. Dang, Akram Ben Ahmed, Abderazek Ben Abdallah, Xuan-Tu Tran
2018	—	`conf`	Parity-Based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication. MCSoC Khanh N. Dang, Xuan-Tu Tran
2017	J	`jnl`	A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model. IEEE Trans. Very Large Scale Integr. Syst. Khanh N. Dang, Akram Ben Ahmed, Xuan-Tu Tran, Yuichi Okuyama, Abderazek Ben Abdallah
2017	J	`jnl`	A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems. J. Supercomput. Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
2016	—	`conf`	Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems. ATS Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah
2016	—	`conf`	Soft-error resilient Network-on-Chip for safety-critical applications. ICICDT Khanh N. Dang, Yuichi Okuyama, Abderazek Ben Abdallah
2015	—	`conf`	Soft-error resilient 3D Network-on-Chip router. iCAST Khanh N. Dang, Michael Conrad Meyer, Yuichi Okuyama, Abderazek Ben Abdallah, Xuan-Tu Tran