Katsuaki Suganuma

12 papers A 1Journal 9Unranked 1
YearRankTypeTitle / Venue / Authors
2018 J jnl
Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure.
Microelectron. Reliab.
Dongjin Kim, Chuantong Chen, Aiji Suetake, Chanyang Choe, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma
2018 J jnl
Influence of thermal exposure upon mechanical/electrical properties and microstructure of sintered micro-porous silver.
Microelectron. Reliab.
Chanyang Choe, Seungjun Noh, Chuantong Chen, Dongjin Kim, Katsuaki Suganuma
2018 J jnl
Large-area die-attachment by silver stress migration bonding for power device applications.
Microelectron. Reliab.
Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li, Katsuaki Suganuma
2015 J jnl
Electromigration behavior in Cu/Ni-P/Sn-Cu based joint system with low current density.
Microelectron. Reliab.
Takuya Kadoguchi, Keisuke Gotou, Kimihiro Yamanaka, Shijo Nagao, Katsuaki Suganuma
2015 J jnl
Power electronics packaging.
Microelectron. Reliab.
Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai
2014 — conf
Evaluation of Stretchable Conductor for Measuring Clothing Pressure.
EuroHaptics (2)
Katsunari Sato, Sayasa Otsubo, Teppei Araki, Tohru Sugahara, Katsuaki Suganuma
2014 — book
Introduction to Printed Electronics
Katsuaki Suganuma
2012 J jnl
Effects of Cu contents in flux on microstructure and joint strength of Sn-3.5Ag soldering with electroless Ni-P/Au surface finish.
Microelectron. Reliab.
Hitoshi Sakurai, Keun-Soo Kim, Kiju Lee, Chang-Jae Kim, Youichi Kukimoto, Katsuaki Suganuma
2011 J jnl
Influence of crystallographic orientation of Sn-Ag-Cu on electromigration in flip-chip joint.
Microelectron. Reliab.
Kiju Lee, Keun-Soo Kim, Yutaka Tsukada, Katsuaki Suganuma, Kimihiro Yamanaka, Soichi Kuritani, Minoru Ueshima
2007 A conf
A flexible and stretchable tactile sensor utilizing static electricity.
IROS
Yasunori Tada, Masahiro Inoue, Toshimi Kawasaki, Yasushi Kawahito, Hiroshi Ishiguro, Katsuaki Suganuma
2007 J jnl
Properties of low temperature Sn-Ag-Bi-In solder systems.
Microelectron. Reliab.
Keun-Soo Kim, Takayuki Imanishi, Katsuaki Suganuma, Minoru Ueshima, Rikiya Kato
2007 J jnl
Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system.
Microelectron. Reliab.
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma