Kaspar M. B. Jansen

23 papers B 1Journal 18Unranked 4
YearRankTypeTitle / Venue / Authors
2024 B conf
Mimosa: Modular Self-folding Hinges Kit for Creating Shape-changing Objects.
TEI
Qiang Liu, Sepideh Ghodrat, Kaspar M. B. Jansen
2022 J jnl
An End-to-End Deep Learning Pipeline for Football Activity Recognition Based on Wearable Acceleration Sensors.
Sensors
Rafael Cuperman, Kaspar M. B. Jansen, Michal G. Ciszewski
2022 J jnl
Development of Low Hysteresis, Linear Weft-Knitted Strain Sensors for Smart Textile Applications.
Sensors
Beyza Bozali, Sepideh Ghodrat, Linda Plaude, Joris J. F. van Dam, Kaspar M. B. Jansen
2021 — conf
Development of hysteresis-free and linear knitted strain sensors for smart textile applications.
IEEE SENSORS
Beyza Bozali, Joris J. F. van Dam, Linda Plaude, Kaspar M. B. Jansen
2020 — conf
A novel sweat rate and conductivity sensor patch made with low-cost fabrication techniques.
IEEE SENSORS
Annemarijn S. M. Steijlen, Jeroen Bastemeijer, Kaspar M. B. Jansen, Patrick J. French, Andre Bossche
2020 — conf
Development of a microfluidic collection system to measure electrolyte variations in sweat during exercise.
EMBC
Annemarijn S. M. Steijlen, Jeroen Bastemeijer, W. A. Groen, Kaspar M. B. Jansen, Pim J. French, Andre Bossche
2020 J jnl
Performance Evaluation of Knitted and Stitched Textile Strain Sensors.
Sensors
Kaspar M. B. Jansen
2019 — conf
How to shape the future of smart clothing.
UbiComp/ISWC Adjunct
Kaspar M. B. Jansen
2016 J jnl
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging.
Microelectron. Reliab.
A. R. Rezaie Adli, Kaspar M. B. Jansen
2014 J jnl
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.
Microelectron. Reliab.
M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang
2012 J jnl
Characterization of the viscoelastic properties of an epoxy molding compound during cure.
Microelectron. Reliab.
M. Sadeghinia, Kaspar M. B. Jansen, Leo J. Ernst
2010 J jnl
A fast moisture sensitivity level qualification method.
Microelectron. Reliab.
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
2010 J jnl
Prediction of cure induced warpage of micro-electronic products.
Microelectron. Reliab.
Jan de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm
2009 J jnl
Fast reliability qualification of SiP products.
Microelectron. Reliab.
Charles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen
2009 J jnl
Modeling and characterization of molding compound properties during cure.
Microelectron. Reliab.
Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, Harald Preu, Matthias Stecher
2007 J jnl
Characterization of moisture properties of polymers for IC packaging.
Microelectron. Reliab.
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
2007 J jnl
Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectron. Reliab.
H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
2007 J jnl
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectron. Reliab.
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
2007 J jnl
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach.
Microelectron. Reliab.
Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst
2007 J jnl
Measuring the through-plane elastic modulus of thin polymer films in situ.
Microelectron. Reliab.
M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel
2007 J jnl
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
Microelectron. Reliab.
Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang
2007 J jnl
Novel shear tools for viscoelastic characterization of packaging polymers.
Microelectron. Reliab.
C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
2007 J jnl
Numerical modeling of warpage induced in QFN array molding process.
Microelectron. Reliab.
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen