Kameswar Rao Vaddina

23 papers B 1C 6Misc 1Journal 5Unranked 10
YearRankTypeTitle / Venue / Authors
2024 — conf
Experimental Assessment and Biaffine Modeling of the Impact of Ambient Temperature on SoC Power Requirements.
SAMOS
Kameswar Rao Vaddina, Florian Brandner, Gérard Memmi, Pierre Jouvelot
2021 C conf
Experimental Workflow for Energy and Temperature Profiling on HPC Systems.
ISCC
Kameswar Rao Vaddina, Laurent Lefèvre, Anne-Cécile Orgerie
2017 Misc conf
Experimental energy profiling of energy-critical embedded applications.
SoftCOM
Kameswar Rao Vaddina, Florian Brandner, Gérard Memmi, Pierre Jouvelot
2017 — conf
Modeling the energy consumption of programs: Thermal aspects and energy/frequency convexity rule (invited paper).
WCSP
Karel De Vogeleer, Kameswar Rao Vaddina, Florian Brandner, Pierre Jouvelot, Gérard Memmi
2016 C conf
Transient Temperature Prediction for Aging Thermal Sensors Using Artificial Neural Network.
PDP
Kameswar Rao Vaddina, Juan M. Cebrian, Lasse Natvig
2014 J jnl
High-Performance and Fault-Tolerant 3D NoC-Bus Hybrid Architecture Using ARB-NET-Based Adaptive Monitoring Platform.
IEEE Trans. Computers
Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2013 J jnl
Design space exploration of thermal-aware many-core systems.
J. Syst. Archit.
Kameswar Rao Vaddina, Amir-Mohammad Rahmani, Mohammad Fattah, Pasi Liljeberg, Juha Plosila
2013 J jnl
ELL-i: An inexpensive platform for fixed things.
Scalable Comput. Pract. Exp.
Pekka Nikander, Kameswar Rao Vaddina, Petri Liuha, Hannu Tenhunen
2013 J jnl
Exploration of Temperature-Aware Placement Approaches in 2D and 3D Stacked Systems.
Int. J. Adapt. Resilient Auton. Syst.
Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila
2012 — conf
ARB-NET: A novel adaptive monitoring platform for stacked mesh 3D NoC architectures.
ASP-DAC
Amir-Mohammad Rahmani, Khalid Latif, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2012 — conf
Analysis of Power Management Strategies for a Single-Chip Cloud Computer.
MARC@RWTH
Robert Eksten, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila
2012 J jnl
Design and management of high-performance, reliable and thermal-aware 3D networks-on-chip.
IET Circuits Devices Syst.
Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2012 — conf
Generic Monitoring and Management Infrastructure for 3D NoC-Bus Hybrid Architectures.
NOCS
Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Khalid Latif, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2012 C conf
Power and Thermal Analysis of Stacked Mesh 3D NoC Using AdaptiveXYZ Routing Algorithm.
DSD
Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2011 — conf
Congestion aware, fault tolerant, and thermally efficient inter-layer communication scheme for hybrid NoC-bus 3D architectures.
NOCS
Amir-Mohammad Rahmani, Pasi Liljeberg, Khalid Latif, Juha Plosila, Kameswar Rao Vaddina, Hannu Tenhunen
2011 C conf
Enhancing Performance Sustainability of Fault Tolerant Routing Algorithms in NoC-Based Architectures.
DSD
Khalid Latif, Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Tiberiu Seceleanu, Pasi Liljeberg, Hannu Tenhunen
2011 B conf
Enhancing Performance of NoC-Based Architectures Using Heuristic Virtual-Channel Sharing Approach.
COMPSAC
Khalid Latif, Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Tiberiu Seceleanu, Pasi Liljeberg, Hannu Tenhunen
2011 — conf
Power and Area Optimization of 3D Networks-on-Chip Using Smart and Efficient Vertical Channels.
PATMOS
Amir-Mohammad Rahmani, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2011 — conf
Power-Efficient Inter-Layer Communication Architectures for 3D NoC.
ISVLSI
Amir-Mohammad Rahmani, Khalid Latif, Kameswar Rao Vaddina, Pasi Liljeberg, Juha Plosila, Hannu Tenhunen
2011 — conf
Thermal Analysis of Advanced 3D Stacked Systems.
ISVLSI
Kameswar Rao Vaddina, Amir-Mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila
2011 C conf
Thermal Analysis of Job Allocation and Scheduling Schemes for 3D Stacked NoC's.
DSD
Kameswar Rao Vaddina, Amir-Mohammad Rahmani, Khalid Latif, Pasi Liljeberg, Juha Plosila
2010 — conf
Thermal modelling of 3D multicore systems in a flip-chip package.
SoCC
Kameswar Rao Vaddina, Tamoghna Mitra, Pasi Liljeberg, Juha Plosila
2009 C conf
Self-timed thermal sensing and monitoring of multicore systems.
DDECS
Kameswar Rao Vaddina, Ethiopia Nigussie, Pasi Liljeberg, Juha Plosila