K. W. Lee - RankMe

16 papers B 1C 1Journal 3Unranked 11

Year	Rank	Type	Title / Venue / Authors
2025	—	`conf`	Demonstration of Logic-Block Performance-Power-Area Gain by 1 CICC H. Fukutome, J. Kim, Joonghan Shin, Youngsoo Lee, S. Chae, B. Eom, Y. S. Nam, Minseong Lee, Sanghyun Ha, E. G. Chung, Sung-Hoon Lee, Sang Kim, K. H. Cho, K. W. Lee, D. W. Kim, H.-J. Cho, K. Rim, J. Song
2023	—	`conf`	Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC. IRPS S. Lee, N.-H. Lee, K. W. Lee, J. H. Kim, J. H. Jin, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae
2022	—	`conf`	Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology. IRPS Nam-Hyun Lee, Sunhang Lee, S.-H. Kim, G.-J. Kim, K. W. Lee, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae
2015	—	`conf`	Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University. 3DIC K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2015	—	`conf`	Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study. 3DIC Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka
2015	—	`conf`	Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. 3DIC K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka
2014	—	`conf`	Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV. 3DIC K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi
2014	—	`conf`	Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI. 3DIC Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka
2010	B	`conf`	A random finite set based detection and tracking using 3D LIDAR in dynamic environments. SMC Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma, Diluka Moratuwage, Nicholas M. Patrikalakis
2010	J	`jnl`	FISST-SLAM: Finite Set Statistical Approach to Simultaneous Localization and Mapping. Int. J. Robotics Res. Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma
2009	J	`jnl`	Joint use of DEA and constrained canonical correlation analysis for efficiency valuations involving categorical variables. J. Oper. Res. Soc. Kyung Sam Park, K. W. Lee, M. S. Park, D. Kim
2004	C	`conf`	Roadmap constrained SLAM in neighborhood environment. ICARCV Javier Ibañez-Guzmán, W. Sardha Wijesoma, K. W. Lee
2000	J	`jnl`	Stochastic models for random-request availability. IEEE Trans. Reliab. K. W. Lee
1995	—	`conf`	Optimal Sizing of Feedforward Neural Networks: Case Studies. ANNES K. W. Lee, H. N. Lam
1995	—	`conf`	Optimising neural network weights using genetic algorithms: a case study. ICNN K. W. Lee, H. N. Lam
1987	—	`conf`	TDX-1: A Distributed System Architecture for High Throughout Telephone Switching. COMPCON W. Yu, S. Y. Kang, K. W. Lee