K. S. Lee - RankMe

Year	Rank	Type	Title / Venue / Authors
2023	—	`conf`	Ongoing Evolution of DRAM Scaling via Third Dimension -Vertically Stacked DRAM -. VLSI Technology and Circuits Jung-Won Han, S. H. Park, Moonyoung Jeong, K. N. Kim, H. J. Kim, J. C. Shin, S. M. Park, S. H. Shin, S. W. Park, K. S. Lee, J. H. Lee, S. H. Kim, B. C. Kim, Myoung H. Jung, I. Y. Yoon, H. Kim, S. U. Jang, K. J. Park, Y. K. Kim, I. G. Kim, J. H. Oh, S. Y. Han, B. S. Kim, Bong Jin Kuh, J. M. Park
2012	J	`jnl`	A novel multiple-channel active noise control approach with neural secondary-path model for interior acoustic noise attenuation of railway train systems. IET Signal Process. H. C. Cho, S. W. Park, K. S. Lee, Nam-Ho Kim
2012	J	`jnl`	Diffusion in annealing of nanocrystalline Ni Int. J. Comput. Appl. Technol. H. L. Seet, M. J. Ong, K. S. Lee, J. B. Yi, X. P. Li
2010	J	`jnl`	Bipolar drive waveform for long-gap high-Xe plasma display panels. Displays J. H. Kim, Myung-Je Jeon, G. H. Hur, K. S. Lee, J. S. Kim, Bong Koo Kang
2009	J	`jnl`	Influence of wall charge on image sticking phenomena in AC plasma display panels. Displays Myung-Je Jeon, M. S. Chung, S. C. Lee, K. S. Lee, J. S. Kim, Bongkoo Kang
2007	J	`jnl`	Semi-automated parametric design of gating systems for die-casting die. Comput. Ind. Eng. S. H. Wu, Jerry Y. H. Fuh, K. S. Lee
1998	J	`jnl`	Automated process parameter resetting for injection moulding: a fuzzy-neuro approach. J. Intell. Manuf. W. He, Y. F. Zhang, K. S. Lee, Jerry Y. H. Fuh, Andrew Y. C. Nee
1995	J	`jnl`	An object-oriented approach to computer-aided design of a plastic injection mould. J. Intell. Manuf. Soh-Khim Ong, S. Prombanpong, K. S. Lee
1991	A	`conf`	Neural network application to the obstacle avoidance path planning for CIM computer integrated manufacturing. IROS C. H. Chung, K. S. Lee
1989	A*	`conf`	Self-tuning control of planar two-link manipulator with non-rigid arm. ICRA Antti J. Koivo, K. S. Lee
1988	A	`conf`	A Frame Grabber For A Multiprocessor Based Vision System. IROS Liang Mong Koh, Eddie Moon Chung Wong, K. S. Lee, T. F. Lee

Year

Rank

Type

Title / Venue / Authors

2023

—

conf

Ongoing Evolution of DRAM Scaling via Third Dimension -Vertically Stacked DRAM -.

VLSI Technology and Circuits

Jung-Won Han, S. H. Park, Moonyoung Jeong, K. N. Kim, H. J. Kim, J. C. Shin, S. M. Park, S. H. Shin, S. W. Park, K. S. Lee, J. H. Lee, S. H. Kim, B. C. Kim, Myoung H. Jung, I. Y. Yoon, H. Kim, S. U. Jang, K. J. Park, Y. K. Kim, I. G. Kim, J. H. Oh, S. Y. Han, B. S. Kim, Bong Jin Kuh, J. M. Park

2012

jnl

A novel multiple-channel active noise control approach with neural secondary-path model for interior acoustic noise attenuation of railway train systems.

IET Signal Process.

H. C. Cho, S. W. Park, K. S. Lee, Nam-Ho Kim

2012

jnl

Diffusion in annealing of nanocrystalline Ni

Int. J. Comput. Appl. Technol.

H. L. Seet, M. J. Ong, K. S. Lee, J. B. Yi, X. P. Li

2010

jnl