| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Neurocomputing
|
| 2025 | J | jnl |
Digit. Signal Process.
|
| 2025 | J | jnl |
Knowl. Based Syst.
|
| 2025 | J | jnl |
IEEE Trans. Cybern.
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
Neural Process. Lett.
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2024 | J | jnl |
Appl. Intell.
|
| 2024 | J | jnl |
Expert Syst. Appl.
|
| 2024 | B | conf |
SMC
|
| 2023 | J | jnl |
Inf. Sci.
|
| 2023 | J | jnl |
Int. J. Wavelets Multiresolution Inf. Process.
|
| 2022 | J | jnl |
IEEE Trans. Knowl. Data Eng.
|
| 2022 | J | jnl |
Knowl. Based Syst.
|
| 2022 | — | conf |
CICAI (2)
|
| 2021 | J | jnl |
Int. J. Wavelets Multiresolution Inf. Process.
|
| 2021 | J | jnl |
J. Real Time Image Process.
|
| 2021 | J | jnl |
Inf. Sci.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | B | conf |
SMC
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Comput. Electr. Eng.
|
| 2018 | J | jnl |
Sci. China Inf. Sci.
|
| 2018 | — | conf |
SPAC
|
| 2018 | B | conf |
SMC
|