| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2013 | — | conf |
COOL Chips
|
| 2011 | B | conf |
GLOBECOM
|
| 2010 | J | jnl |
A robust seamless communication architecture for next-generation mobile terminals on multi-CPU SoCs.
ACM Trans. Embed. Comput. Syst.
|
| 2010 | Misc | conf |
ICNC
|
| 2009 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2008 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2008 | J | jnl |
IEEE Micro
|
| 2008 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2007 | Misc | conf |
CODES+ISSS
|
| 2007 | — | conf |
ASP-DAC
|
| 2006 | A* | conf |
DAC
|
| 2005 | Misc | conf |
CODES+ISSS
|