| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | B | conf |
TEI
|
| 2025 | C | conf |
ISCAS
|
| 2025 | — | conf |
UIST Adjunct
|
| 2025 | C | conf |
ICCD
|
| 2025 | A* | conf |
UIST
|
| 2025 | — | conf |
UIST Adjunct
|
| 2025 | — | conf |
CHI Extended Abstracts
|
| 2025 | C | conf |
ICCD
|
| 2025 | — | conf |
UIST Adjunct
|
| 2024 | — | conf |
ITSC
|
| 2024 | — | conf |
APCCAS
|
| 2024 | — | conf |
APCCAS
|
| 2024 | — | conf |
CHI Extended Abstracts
|
| 2024 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2024 | — | conf |
UIST (Adjunct Volume)
|
| 2024 | C | conf |
APSEC
|
| 2024 | — | conf |
CF
|
| 2024 | Misc | conf |
QCE
|
| 2023 | — | conf |
SPLASH Companion
|
| 2023 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2023 | C | conf |
ISCAS
|
| 2023 | A* | conf |
MICRO
|
| 2023 | J | jnl |
IEEE Des. Test
|
| 2023 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2023 | Misc | conf |
SenSys
|
| 2023 | Misc | conf |
SenSys
|
| 2023 | — | conf |
UIST (Adjunct Volume)
|
| 2022 | — | conf |
ASP-DAC
|
| 2022 | — | conf |
MCSoC
|
| 2021 | C | conf |
ICCD
|
| 2021 | C | conf |
ICCD
|
| 2021 | — | conf |
MCSoC
|
| 2021 | J | jnl |
IEEE Pervasive Comput.
|
| 2020 | B | conf |
FPL
|
| 2020 | — | conf |
COOL CHIPS
|
| 2020 | — | conf |
AsianCHI@CHI
|
| 2020 | — | conf |
ASP-DAC
|
| 2020 | C | conf |
ICCD
|
| 2019 | — | conf |
CHI Extended Abstracts
|
| 2019 | — | conf |
FPT
|
| 2019 | C | conf |
ICCD
|
| 2018 | — | conf |
FPT
|
| 2018 | J | jnl |
Int. J. Netw. Comput.
|
| 2018 | — | conf |
ISSCC
|
| 2017 | — | conf |
CANDAR
|
| 2017 | — | conf |
ISOCC
|
| 2016 | — | conf |
ESSCIRC
|
| 2016 | J | jnl |
IEEE J. Solid State Circuits
|
| 2016 | — | conf |
A-SSCC
|
| 2016 | J | jnl |
IEICE Trans. Electron.
|
| 2016 | — | conf |
ASP-DAC
|
| 2016 | — | conf |
CANDAR
|
| 2015 | — | conf |
ISSCC
|
| 2015 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|