| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2025 | J | jnl |
Pattern Recognit.
|
| 2025 | J | jnl |
Veh. Commun.
|
| 2025 | A* | conf |
ICML
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2025 | J | jnl |
IEEE Trans. Emerg. Top. Comput. Intell.
|
| 2024 | J | jnl |
IEEE Trans. Artif. Intell.
|
| 2024 | J | jnl |
IEEE Trans. Emerg. Top. Comput. Intell.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Trans. Emerg. Telecommun. Technol.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
ICDCS Workshops
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Cybern.
|
| 2023 | J | jnl |
IEEE Trans. Cybern.
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
ICCIR
|
| 2022 | J | jnl |
IEEE Trans. Cybern.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2020 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2020 | J | jnl |
Signal Process.
|
| 2020 | J | jnl |
Signal Process.
|
| 2019 | J | jnl |
J. Circuits Syst. Comput.
|
| 2019 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2019 | C | conf |
IWDW
|
| 2019 | J | jnl |
J. Circuits Syst. Comput.
|
| 2019 | J | jnl |
The dynamic model of pulverized coal and waste plastic bonded together in flight combustion process.
Clust. Comput.
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2017 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2016 | J | jnl |
Neurocomputing
|
| 2015 | J | jnl |
Appl. Soft Comput.
|
| 2014 | J | jnl |
Adv. Eng. Softw.
|
| 2013 | J | jnl |
J. Frankl. Inst.
|
| 2013 | B | conf |
GLOBECOM
|
| 2011 | J | jnl |
Int. J. Comput. Appl. Technol.
|
| 2011 | — | conf |
ICDMA
|
| 2009 | J | jnl |
Inf. Media Technol.
|
| 2007 | — | conf |
SKG
|