| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ISSCC
|
| 2026 | J | jnl |
Sci. China Inf. Sci.
|
| 2025 | J | jnl |
Symmetry
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | — | conf |
RWS
|
| 2024 | J | jnl |
J. Circuits Syst. Comput.
|
| 2024 | — | conf |
WiSNeT
|
| 2024 | — | conf |
RWS
|
| 2024 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2024 | A* | conf |
DAC
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
Sci. China Inf. Sci.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | — | conf |
IEEECONF
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
Sci. China Inf. Sci.
|
| 2019 | J | jnl |
Proc. IEEE
|
| 2019 | J | jnl |
Proc. IEEE
|
| 2017 | J | jnl |
IEEE Commun. Mag.
|
| 2011 | J | jnl |
Comput. Electr. Eng.
|
| 2007 | C | conf |
ICEC
|
| 2007 | J | jnl |
IEICE Trans. Electron.
|
| 2007 | J | jnl |
IEICE Trans. Electron.
|
| 2006 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2006 | — | conf |
APCCAS
|
| 2005 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2005 | J | jnl |
IEICE Trans. Electron.
|
| 2005 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|