| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2025 | J | jnl |
IET Commun.
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | — | conf |
ITSC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
CoRR
|
| 2024 | Misc | conf |
NSDI
|
| 2024 | J | jnl |
Symmetry
|
| 2024 | J | jnl |
Commun. Nonlinear Sci. Numer. Simul.
|
| 2024 | J | jnl |
Int. J. Cogn. Informatics Nat. Intell.
|
| 2024 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
BMC Medical Informatics Decis. Mak.
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Comput. Commun.
|
| 2023 | A* | conf |
AAAI
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Knowl. Based Syst.
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | C | conf |
IECON
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Comput. Aided Des.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | C | conf |
SEKE
|
| 2022 | J | jnl |
CoRR
|
| 2022 | — | conf |
CSCloud/EdgeCom
|
| 2022 | J | jnl |
Sensors
|
| 2021 | — | conf |
FIRE (Working Notes)
|
| 2021 | J | jnl |
Int. J. Web Grid Serv.
|
| 2021 | J | jnl |
Signal Process.
|
| 2021 | J | jnl |
Comparative study of electro-thermal characteristics of 4500 V diffusion-CS IGBT and buried-CS IGBT.
IET Circuits Devices Syst.
|
| 2021 | — | conf |
AIAM (IEEE)
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Sensors
|
| 2021 | B | conf |
ICIP
|
| 2020 | B | conf |
COLING
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
World Wide Web
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
J. Intell. Fuzzy Syst.
|
| 2020 | — | conf |
ICMSSP
|
| 2019 | — | conf |
IDAACS
|
| 2019 | — | conf |
IDAACS
|
| 2019 | — | conf |
IDAACS
|
| 2019 | — | conf |
MMAsia
|
| 2019 | — | conf |
ISICA
|
| 2019 | J | jnl |
IEEE ACM Trans. Comput. Biol. Bioinform.
|
| 2018 | — | conf |
ICBDR
|
| 2017 | J | jnl |
IEEE Access
|
| 2017 | J | jnl |
IEEE Access
|
| 2017 | — | conf |
ASICON
|
| 2017 | — | conf |
NVMSA
|
| 2015 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2015 | B | conf |
DSAA
|
| 2014 | — | conf |
IIKI
|
| 2014 | Misc | conf |
AIAI
|
| 2013 | J | jnl |
J. Comput. Aided Mol. Des.
|
| 2010 | — | conf |
WCSP
|
| 2009 | B | conf |
MASS
|
| 2006 | C | conf |
ICARCV
|
| 2006 | C | conf |
ICARCV
|
| 2005 | J | jnl |
J. Comput. Chem.
|
| 2004 | J | jnl |
J. Comput. Chem.
|
| 2004 | A* | conf |
DAC
|
| 2004 | J | jnl |
J. Comput. Chem.
|
| 2004 | J | jnl |
J. Comput. Chem.
|
| 2001 | J | jnl |
Predicting sequences and structures of MHC-binding peptides: a computational combinatorial approach.
J. Comput. Aided Mol. Des.
|