| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | A | conf |
IROS
|
| 2025 | J | jnl |
J. Comput. Networks Commun.
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2025 | — | conf |
ICSOC (2)
|
| 2025 | J | jnl |
IEEE Instrum. Meas. Mag.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2024 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | C | conf |
ICARCV
|
| 2024 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Comput. Electron. Agric.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | — | conf |
CISP-BMEI
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
Comput. Educ.
|
| 2023 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Complex.
|
| 2021 | J | jnl |
Knowl. Based Syst.
|
| 2021 | J | jnl |
Int. J. Softw. Informatics
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
EITCE
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
CSIA (1)
|
| 2020 | — | conf |
CSIA (1)
|
| 2020 | — | conf |
CSIA (1)
|
| 2020 | J | jnl |
Wirel. Networks
|
| 2020 | J | jnl |
Complex.
|
| 2019 | J | jnl |
J. Sensors
|
| 2019 | J | jnl |
Sensors
|
| 2018 | C | conf |
IGARSS
|
| 2018 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2018 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2016 | J | jnl |
J. Comput. Inf. Sci. Eng.
|
| 2016 | C | conf |
IECON
|
| 2015 | — | conf |
WCSP
|
| 2015 | — | conf |
WCSP
|
| 2014 | A* | conf |
CHI
|
| 2014 | J | jnl |
Comput. Entertain.
|
| 2013 | — | conf |
CCNC
|
| 2013 | J | jnl |
J. Appl. Math.
|
| 2012 | C | conf |
APSEC
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2012 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2012 | C | conf |
Advances in Computer Entertainment
|
| 2012 | C | conf |
ICEC
|
| 2012 | B | conf |
ICMI
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2011 | Misc | conf |
UbiComp
|
| 2011 | J | jnl |
Microelectron. Reliab.
|
| 2011 | — | conf |
Advances in Computer Entertainment Technology
|
| 2011 | — | conf |
SIGGRAPH Asia Emerging Technologies
|
| 2011 | — | conf |
IGIC
|
| 2011 | — | conf |
QSIC
|
| 2010 | Misc | conf |
ICMLC
|
| 2010 | — | conf |
IITSI
|
| 2010 | — | conf |
UIC/ATC Workshops
|
| 2009 | — | conf |
IESA
|
| 2009 | — | conf |
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation.
3DIC
|
| 2009 | J | jnl |
Int. J. Model. Identif. Control.
|
| 2008 | C | conf |
APSCC
|
| 2008 | — | conf |
ICEBE
|
| 2008 | — | conf |
NAS
|
| 2008 | C | conf |
SEKE
|
| 2008 | J | jnl |
J. Commun.
|
| 2008 | — | conf |
IESA
|
| 2007 | C | conf |
APSCC
|
| 2007 | J | jnl |
Int. J. Image Graph.
|
| 2006 | — | conf |
CONFENIS
|
| 2005 | — | conf |
GCC
|
| 2004 | J | jnl |
IEEE Signal Process. Lett.
|
| 2004 | B | conf |
COMPSAC
|
| 2001 | — | conf |
AOSE
|
| 1998 | J | jnl |
IEEE Netw.
|
| 1996 | J | jnl |
IEEE Trans. Medical Imaging
|