| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
J. Multim. Inf. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2025 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
Group signature with restrictive linkability: minimizing privacy exposure in ubiquitous environment.
J. Ambient Intell. Humaniz. Comput.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
J. Supercomput.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
J. Supercomput.
|
| 2023 | J | jnl |
J. Supercomput.
|
| 2023 | J | jnl |
Soft Comput.
|
| 2023 | J | jnl |
J. Supercomput.
|
| 2022 | J | jnl |
J. Supercomput.
|
| 2022 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2022 | J | jnl |
J. Supercomput.
|
| 2021 | J | jnl |
Int. J. Commun. Syst.
|
| 2021 | J | jnl |
Symmetry
|
| 2020 | J | jnl |
Entropy
|
| 2020 | J | jnl |
EURASIP J. Image Video Process.
|
| 2020 | J | jnl |
Hum. centric Comput. Inf. Sci.
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
J. Multim. Inf. Syst.
|
| 2020 | J | jnl |
J. Inf. Process. Syst.
|
| 2020 | J | jnl |
J. Supercomput.
|
| 2019 | J | jnl |
J. Supercomput.
|
| 2019 | J | jnl |
J. Supercomput.
|
| 2019 | J | jnl |
J. Inf. Process. Syst.
|
| 2019 | J | jnl |
Clust. Comput.
|
| 2019 | J | jnl |
Blockchain-based mobile fingerprint verification and automatic log-in platform for future computing.
J. Supercomput.
|
| 2019 | J | jnl |
J. Inf. Process. Syst.
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | J | jnl |
Mob. Inf. Syst.
|
| 2018 | J | jnl |
J. Multim. Inf. Syst.
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | J | jnl |
J. Multim. Inf. Syst.
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | J | jnl |
J. Inf. Process. Syst.
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | C | conf |
PDCAT
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | J | jnl |
Multim. Tools Appl.
|
| 2018 | J | jnl |
Symmetry
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | — | conf |
MUE/FutureTech
|
| 2018 | J | jnl |
Int. J. Distributed Sens. Networks
|
| 2018 | — | conf |
ICISA
|
| 2018 | J | jnl |
Sensors
|
| 2017 | — | conf |
CSA/CUTE
|
| 2017 | J | jnl |
J. Multim. Inf. Syst.
|
| 2017 | — | conf |
CSA/CUTE
|
| 2017 | — | conf |
CSA/CUTE
|
| 2017 | — | conf |
ICISA
|
| 2017 | J | jnl |
J. Multim. Inf. Syst.
|
| 2017 | — | conf |
IMCOM
|
| 2017 | J | jnl |
J. Multim. Inf. Syst.
|
| 2017 | J | jnl |
Sensors
|
| 2017 | — | conf |
CSA/CUTE
|
| 2017 | — | conf |
CSA/CUTE
|
| 2017 | — | conf |
ICISA
|
| 2017 | J | jnl |
Hum. centric Comput. Inf. Sci.
|
| 2016 | J | jnl |
J. Multim. Inf. Syst.
|
| 2016 | — | conf |
CSA/CUTE
|
| 2016 | J | jnl |
J. Supercomput.
|
| 2016 | J | jnl |
Hum. centric Comput. Inf. Sci.
|
| 2016 | — | conf |
IMCOM
|
| 2016 | J | jnl |
J. Multim. Inf. Syst.
|
| 2016 | — | conf |
SCIS&ISIS
|
| 2015 | — | conf |
CSA/CUTE
|
| 2015 | — | conf |
CSA/CUTE
|
| 2015 | — | conf |
CSA/CUTE
|
| 2014 | J | jnl |
J. Multim. Inf. Syst.
|
| 2014 | J | jnl |
IEICE Electron. Express
|
| 2014 | J | jnl |
J. Multim. Inf. Syst.
|
| 2014 | J | jnl |
J. Multim. Inf. Syst.
|
| 2001 | J | jnl |
IEEE Trans. Consumer Electron.
|