| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2026 | J | jnl |
IEEE Trans. Reliab.
|
| 2026 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2026 | J | jnl |
IEEE Trans. Reliab.
|
| 2026 | J | jnl |
Int. J. Sens. Networks
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
IEEE Trans. Reliab.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | A* | conf |
MobiCom
|
| 2024 | J | jnl |
Peer Peer Netw. Appl.
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | — | conf |
WiseML@WiSec
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Mob. Networks Appl.
|
| 2023 | J | jnl |
Expert Syst. Appl.
|
| 2023 | J | jnl |
Int. J. Sens. Networks
|
| 2023 | J | jnl |
Expert Syst. Appl.
|
| 2023 | — | conf |
CollaborateCom (1)
|
| 2023 | — | conf |
CACML
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
HCCS
|
| 2022 | — | conf |
WASA (3)
|
| 2022 | — | conf |
WASA (3)
|
| 2022 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2022 | J | jnl |
Expert Syst. Appl.
|
| 2021 | — | conf |
WASA (1)
|
| 2021 | B | conf |
IJCNN
|
| 2021 | J | jnl |
J. Electronic Imaging
|
| 2021 | — | conf |
WASA (3)
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2021 | — | conf |
WASA (3)
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2021 | B | conf |
IJCNN
|
| 2021 | B | conf |
IJCNN
|
| 2020 | J | jnl |
Comput. Commun.
|
| 2020 | — | conf |
CollaborateCom (2)
|
| 2020 | — | conf |
WASA (1)
|
| 2020 | — | conf |
WASA (2)
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
IEICE Trans. Commun.
|
| 2019 | — | conf |
WASA
|
| 2019 | — | conf |
WASA
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Sensors
|