Juan S. Ordonez

18 papers Journal 2Unranked 16
YearRankTypeTitle / Venue / Authors
2018 — conf
PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical Devices.
EMBC
Sharif Khan, Daniel Scholz, Juan S. Ordonez, Thomas Stieglitz
2017 J jnl
Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In Vivo.
Sensors
Stefan B. Rieger, Jennifer Pfau, Thomas Stieglitz, Maria Asplund, Juan S. Ordonez
2017 — conf
Dual-sided process with graded interfaces for adhering underfill and globtop materials to microelectrode arrays.
NER
Sharif Khan, Juan S. Ordonez, Thomas Stieglitz
2017 — conf
Improved long-term stability of thin-film glassy carbon electrodes through the use of silicon carbide and amorphous carbon.
NER
Maria Vomero, Elisa Castagnola, Juan S. Ordonez, Stefano Carli, Elena Zucchini, Emma Maggiolini, Calogero Gueli, Noah Goshi, Luciano Fadiga, Davide Ricci, Sam Kassegne, Thomas Stieglitz
2017 J jnl
Let There Be Light - Optoprobes for Neural Implants.
Proc. IEEE
Marie T. Alt, Eva Fiedler, Linda Rudmann, Juan S. Ordonez, Patrick Ruther, Thomas Stieglitz
2017 — conf
Mechanical deformation and chemical degradation of thin-film platinum under aging and electrical stimulation.
NER
Jennifer Pfau, Thomas Stieglitz, Juan S. Ordonez
2015 — conf
Development of a multichannel implantable connector.
EMBC
Julia Koch, Juan S. Ordonez, Thomas Stieglitz, Martin Schuettler
2015 — conf
Hybrid multimodal Deep Brain probe (DBS array) for advanced brain research.
NER
D. Ashouri Vajari, Juan S. Ordonez, L. Furlanetti, M. Dobrossy, Volker A. Coenen, Thomas Stieglitz
2015 — conf
Mechanical deformation of thin film platinum under electrical stimulation.
EMBC
Juan S. Ordonez, Linda Rudmann, Paul Cvancara, Christian Bentler, Thomas Stieglitz
2015 — conf
Non-hermetic encapsulation for implantable electronic devices based on epoxy.
EMBC
Fabian Boeser, Juan S. Ordonez, Martin Schuettler, Thomas Stieglitz, Dennis T. T. Plachta
2014 — conf
A polymer-metal two step sealing concept for hermetic neural implant packages.
EMBC
Fabian Kohler, Patrick Kiele, Juan S. Ordonez, Thomas Stieglitz, Martin Schuettler
2014 — conf
Cuff electrodes for very small diameter nerves - Prototyping and first recordings in vivo.
EMBC
Juan S. Ordonez, Victor Pikov, Harvey Wiggins, Craig Patten, Thomas Stieglitz, J. Rickert, Martin Schuettler
2012 — conf
A 232-channel retinal vision prosthesis with a miniaturized hermetic package.
EMBC
Juan S. Ordonez, Martin Schuettler, Maurits Ortmanns, Thomas Stieglitz
2012 — conf
Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.
EMBC
Martin Schuettler, Fabian Kohler, Juan S. Ordonez, Thomas Stieglitz
2012 — conf
Hermetic glass soldered micro-packages for a vision prosthesis.
EMBC
Juan S. Ordonez, Philip Dautel, Martin Schuettler, Thomas Stieglitz
2012 — conf
Improved polyimide thin-film electrodes for neural implants.
EMBC
Juan S. Ordonez, Christian Böhler, Martin Schuettler, Thomas Stieglitz
2011 — conf
A blister-test apparatus for studies on the adhesion of materials used for neural electrodes.
EMBC
Juan S. Ordonez, Christian Böhler, Martin Schuettler, Thomas Stieglitz
2011 — conf
Ensuring minimal humidity levels in hermetic implant housings.
EMBC
Martin Schuettler, Andreas Schatz, Juan S. Ordonez, Thomas Stieglitz