| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
J. Electronic Imaging
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | — | conf |
AsiaSim
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2023 | — | conf |
AsiaSim (1)
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
J. Comput. Des. Eng.
|
| 2023 | — | conf |
ICDIP
|
| 2023 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
ICMIP
|
| 2020 | — | conf |
ICMIP
|
| 2019 | — | conf |
AsiaSim
|
| 2018 | — | conf |
CSPS (2)
|
| 2018 | — | conf |
I2MTC
|
| 2017 | — | conf |
CCCV (1)
|
| 2014 | C | conf |
ICMV
|