Joungho Kim

53 papers A* 3Journal 23Unranked 27
YearRankTypeTitle / Venue / Authors
2025 — conf
RL4CO: An Extensive Reinforcement Learning for Combinatorial Optimization Benchmark.
KDD (2)
Federico Berto, Chuanbo Hua, Junyoung Park, Laurin Luttmann, Yining Ma, Fanchen Bu, Jiarui Wang, Haoran Ye, Minsu Kim, Sanghyeok Choi, Nayeli Gast Zepeda, André Hottung, Jianan Zhou, Jieyi Bi, Yu Hu, Fei Liu, Hyeonah Kim, Jiwoo Son, Haeyeon Kim, Davide Angioni, Wouter Kool, Zhiguang Cao, Qingfu Zhang, Joungho Kim, Jie Zhang, Kijung Shin, Cathy Wu, Sungsoo Ahn, Guojie Song, Changhyun Kwon, Kevin Tierney, Lin Xie, Jinkyoo Park
2023 A* conf
DevFormer: A Symmetric Transformer for Context-Aware Device Placement.
ICML
Haeyeon Kim, Minsu Kim, Federico Berto, Joungho Kim, Jinkyoo Park
2023 — conf
Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect.
ISOCC
Jiwon Yoon, Hyunwoo Kim, Boogyo Sim, HyunWook Park, Yi-Gyeong Kim, Sujin Park, Youngsu Kwon, Joungho Kim
2023 J jnl
RL4CO: an Extensive Reinforcement Learning for Combinatorial Optimization Benchmark.
CoRR
Federico Berto, Chuanbo Hua, Junyoung Park, Minsu Kim, Hyeonah Kim, Jiwoo Son, Haeyeon Kim, Joungho Kim, Jinkyoo Park
2022 J jnl
Collaborative Distillation Meta Learning for Simulation Intensive Hardware Design.
CoRR
Haeyeon Kim, Minsu Kim, Joungho Kim, Jinkyoo Park
2022 J jnl
Transformer Network-based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM).
CoRR
HyunWook Park, Minsu Kim, Seongguk Kim, Keunwoo Kim, Haeyeon Kim, Taein Shin, Keeyoung Son, Boogyo Sim, Subin Kim, Seungtaek Jeong, Chulsoon Hwang, Joungho Kim
2021 A* conf
Learning Collaborative Policies to Solve NP-hard Routing Problems.
NeurIPS
Minsu Kim, Jinkyoo Park, Joungho Kim
2021 J jnl
Learning Collaborative Policies to Solve NP-hard Routing Problems.
CoRR
Minsu Kim, Jinkyoo Park, Joungho Kim
2019 J jnl
Low Leakage Electromagnetic Field Level and High Efficiency Using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System.
IEEE Trans. Ind. Electron.
Seongsoo Lee, Donghyun Kim, YeonJe Cho, Hongseok Kim, Chiuk Song, Seungtaek Jeong, Jinwook Song, Gyeyoung Park, Seokwoo Hong, Junyong Park, Kyungjun Cho, Hyunsuk Lee, Chulhun Seo, Seungyoung Ahn, Joungho Kim
2019 J jnl
Smartwatch Strap Wireless Power Transfer System With Flexible PCB Coil and Shielding Material.
IEEE Trans. Ind. Electron.
Seungtaek Jeong, Donghyun Kim, Jinwook Song, Hongseok Kim, Seongsoo Lee, Chiuk Song, Jaehak Lee, Junyeop Song, Joungho Kim
2018 J jnl
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s.
IEEE Trans. Circuits Syst. I Regul. Pap.
Yeseul Jeon, Heegon Kim, Joungho Kim, Minkyu Je
2018 J jnl
EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger Using Tightly Coupled Three-Phase Resonant Magnetic Field.
IEEE Trans. Ind. Electron.
Chiuk Song, Hongseok Kim, Youngwoo Kim, Donghyun Kim, Seungtaek Jeong, YeonJe Cho, Seongsoo Lee, Seungyoung Ahn, Joungho Kim
2018 J jnl
High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications.
IEEE Trans. Ind. Electron.
Min-Woo Kim, Ji H. Kim, YeonJe Cho, Minsik Kim, Bo H. Choi, Kwyro Lee, Joungho Kim, Gyu-Hyeong Cho, Chun-Taek Rim
2018 J jnl
Miniaturized and high-performance RF packages with ultra-thin glass substrates.
Microelectron. J.
Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala
2017 J jnl
Application of Machine Learning for Optimization of 3-D Integrated Circuits and Systems.
IEEE Trans. Very Large Scale Integr. Syst.
Sung Joo Park, Bumhee Bae, Joungho Kim, Madhavan Swaminathan
2016 — conf
Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC.
3DIC
Subin Kim, Youngwoo Kim, Kyungjun Cho, Jinwook Song, Joungho Kim
2016 J jnl
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.
IEEE Des. Test
Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim
2015 — conf
Active Si interposer for 3D IC integrations.
3DIC
Joungho Kim
2015 — conf
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.
3DIC
Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
2015 J jnl
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).
IEEE Trans. Computers
Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
2015 — conf
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module.
3DIC
Hyunsuk Lee, Kyungjun Cho, Heegon Kim, Sumin Choi, Jaemin Lim, Joungho Kim
2015 — conf
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.
3DIC
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2015 — conf
Noise coupling modeling and analysis of through glass via(TGV).
3DIC
Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim
2015 — conf
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.
EMC Compo
Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
2015 — conf
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.
EMC Compo
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
2014 — conf
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.
3DIC
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala
2014 J jnl
Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System.
IEICE Trans. Commun.
Yangbae Chun, Seongwook Park, Jonghoon J. Kim, Jiseong Kim, Hongseok Kim, Joungho Kim, Nam Kim, Seungyoung Ahn
2014 — conf
Fault detection and isolation of multiple defects in through silicon via (TSV) channel.
3DIC
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2014 — conf
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.
3DIC
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
2013 — conf
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.
3DIC
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
2013 — conf
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.
3DIC
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
2013 J jnl
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System.
Proc. IEEE
Jiseong Kim, Jonghoon J. Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, Seungyoung Ahn
2013 — conf
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.
EMC Compo
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.
EMC Compo
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Eye-diagram simulation and analysis of a high-speed TSV-based channel.
3DIC
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Fault isolation of short defect in through silicon via (TSV) based 3D-IC.
3DIC
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013 — conf
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.
EMC Compo
Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim
2013 — conf
Modeling and analysis of open defect in through silicon via (TSV) channel.
EMC Compo
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013 — conf
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.
3DIC
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Signal integrity design of TSV and interposer in 3D-IC.
LASCAS
Jonghyun Cho, Joungho Kim
2013 — conf
Signal integrity modeling and measurement of TSV in 3D IC.
ASP-DAC
Joohee Kim, Joungho Kim
2012 — conf
3D-MAPS: 3D Massively parallel processor with stacked memory.
ISSCC
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
2011 — conf
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.
ISQED
Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon
2011 A* conf
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC.
DAC
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim
2010 J jnl
Frequency-Dependent Transmission Line Model of a Stranded Coaxial Cable.
IEICE Trans. Electron.
Jiseong Kim, Eakhwan Song, Jeonghyeon Cho, Yujeong Shim, Gawon Kim, Joungho Kim
2008 J jnl
A Delay Line Circuit Design for Crosstalk Minimization Using Genetic Algorithm.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Chaeho Chung, Soobum Lee, Byung Man Kwak, Gawon Kim, Joungho Kim
2008 J jnl
Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network.
IEICE Trans. Electron.
Hyunjeong Park, Hyungsoo Kim, Junso Pak, Changwook Yoon, Kyoungchoul Koo, Joungho Kim
2008 J jnl
Design of a Low-Noise UWB Transceiver SiP.
IEEE Des. Test Comput.
Changwook Yoon, Junwoo Lee, Young-Jin Park, Hyunjeong Park, Jaemin Kim, Junso Pak, Joungho Kim
2006 J jnl
Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB.
IEICE Trans. Electron.
Junso Pak, Masahiro Aoyagi, Katsuya Kikuchi, Joungho Kim
2006 J jnl
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery.
IEEE J. Solid State Circuits
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoi-Jun Yoo, Joungho Kim
2006 J jnl
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.
IEEE Des. Test Comput.
Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee
2005 J jnl
Modeling and Measurement of Mode-Conversion and Frequency Dependent Loss in High-Speed Differential Interconnections on Multilayer PCB.
IEICE Trans. Electron.
Seungyong Baek, Jingook Kim, Joungho Kim
2005 — conf
Noise generation, coupling, isolation, and EM radiation in high-speed package and PCB.
ISCAS (6)
Joungho Kim, Junso Pak, Jongbae Park, Hyungsoo Kim