Jonghyun Cho

14 papers A* 1Journal 4Unranked 9
YearRankTypeTitle / Venue / Authors
2017 J jnl
Electromagnetic Interference Analysis of an Inhomogeneous Electromagnetic Bandgap Power Bus for High-Speed Circuits.
J. Inform. and Commun. Convergence Engineering
Jonghyun Cho, Myunghoi Kim
2017 J jnl
TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization.
IEEE Trans. Instrum. Meas.
Francesco de Paulis, Stefano Piersanti, Qian Wang, Jonghyun Cho, Nicholas Erickson, Brice Achkir, Jun Fan, James L. Drewniak, Antonio Orlandi
2016 J jnl
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.
IEEE Des. Test
Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim
2016 J jnl
Suppression of Parallel Plate Modes Using Edge-Located EBG Structure in High-Speed Power Bus.
J. Inform. and Commun. Convergence Engineering
Jonghyun Cho, Myunghoi Kim
2015 — conf
Noise coupling modeling and analysis of through glass via(TGV).
3DIC
Insu Hwang, Jihye Kim, Youngwoo Kim, Jonghyun Cho, Joungho Kim
2014 — conf
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.
3DIC
Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Heegon Kim, Joungho Kim, Srikrishna Sitaraman, Venky Sundaram, Rao R. Tummala
2013 — conf
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.
3DIC
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
2013 — conf
Analysis of glass interposer PDN and proposal of PDN resonance suppression methods.
3DIC
Jonghyun Cho, Youngwoo Kim, Joungho Kim, Venky Sundaram, Rao R. Tummala
2013 — conf
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.
EMC Compo
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Eye-diagram simulation and analysis of a high-speed TSV-based channel.
3DIC
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Fault isolation of short defect in through silicon via (TSV) based 3D-IC.
3DIC
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013 — conf
Signal integrity design of TSV and interposer in 3D-IC.
LASCAS
Jonghyun Cho, Joungho Kim
2011 — conf
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.
ISQED
Taigon Song, Chang Liu, Dae Hyun Kim, Sung Kyu Lim, Jonghyun Cho, Joohee Kim, Junso Pak, Seungyoung Ahn, Joungho Kim, Kihyun Yoon
2011 A* conf
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC.
DAC
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, Joungho Kim, Sung Kyu Lim