Jonghoon J. Kim

16 papers Journal 2Unranked 14
YearRankTypeTitle / Venue / Authors
2021 — conf
Industry's First 7.2 Gbps 512GB DDR5 Module.
HCS
Sung Joo Park, Jonghoon J. Kim, Kun Joo, Young-Ho Lee, Kyoungsun Kim, Young-Tae Kim, Woo-Jin Na, IkJoon Choi, Hye-Seung Yu, Wonyoung Kim, Ju-Yeon Jung, Jaejun Lee, Dohyung Kim, Young-Uk Chang, Gong-Heum Han, Hangi-Jung, Sunwon Kang, Jeonghyeon Cho, Hoyoung Song, Tae-Young Oh, Young-Soo Sohn, Sangjoon Hwang, Jooyoung Lee
2015 — conf
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.
3DIC
Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim
2015 — conf
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.
3DIC
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2015 — conf
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC.
EMC Compo
Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim
2015 — conf
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC.
EMC Compo
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim
2014 J jnl
Electromagnetic Compatibility of Resonance Coupling Wireless Power Transfer in On-Line Electric Vehicle System.
IEICE Trans. Commun.
Yangbae Chun, Seongwook Park, Jonghoon J. Kim, Jiseong Kim, Hongseok Kim, Joungho Kim, Nam Kim, Seungyoung Ahn
2014 — conf
Fault detection and isolation of multiple defects in through silicon via (TSV) channel.
3DIC
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2014 — conf
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.
3DIC
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim
2013 J jnl
Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System.
Proc. IEEE
Jiseong Kim, Jonghoon J. Kim, Sunkyu Kong, Hongseok Kim, In-Soo Suh, Nam Pyo Suh, Dong-Ho Cho, Joungho Kim, Seungyoung Ahn
2013 — conf
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.
EMC Compo
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.
EMC Compo
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Eye-diagram simulation and analysis of a high-speed TSV-based channel.
3DIC
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park
2013 — conf
Fault isolation of short defect in through silicon via (TSV) based 3D-IC.
3DIC
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013 — conf
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment.
EMC Compo
Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim
2013 — conf
Modeling and analysis of open defect in through silicon via (TSV) channel.
EMC Compo
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi
2013 — conf
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling.
3DIC
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park