| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Comput. Electron. Agric.
|
| 2026 | J | jnl |
IEEE Access
|
| 2025 | — | conf |
HCI (21)
|
| 2025 | J | jnl |
Informatics
|
| 2025 | — | conf |
HCI (21)
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
ACM Trans. Softw. Eng. Methodol.
|
| 2025 | J | jnl |
Inf. Softw. Technol.
|
| 2024 | — | conf |
HCI (21)
|
| 2024 | — | conf |
HCI (20)
|
| 2024 | — | conf |
HCI (20)
|
| 2024 | — | conf |
HCI (20)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2023 | — | conf |
HCI (16)
|
| 2023 | J | jnl |
J. Syst. Softw.
|
| 2023 | — | conf |
HCI (16)
|
| 2023 | J | jnl |
IEEE Trans. Software Eng.
|
| 2022 | — | conf |
HCI (14)
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Sensors
|
| 2021 | C | conf |
SEKE
|
| 2021 | C | conf |
SEKE
|
| 2021 | — | conf |
DMSVIVA
|
| 2020 | — | conf |
HCI (41)
|
| 2020 | J | jnl |
CLEI Electron. J.
|
| 2020 | A | conf |
EASE
|
| 2020 | C | conf |
SEKE
|
| 2019 | J | jnl |
Inf. Softw. Technol.
|
| 2019 | J | jnl |
Inf. Softw. Technol.
|
| 2019 | — | conf |
CIbSE
|
| 2019 | J | jnl |
Int. J. Softw. Eng. Knowl. Eng.
|
| 2019 | — | conf |
CIbSE
|
| 2019 | C | conf |
SEKE
|
| 2018 | — | conf |
ICSE (Companion Volume)
|
| 2018 | — | conf |
ICITS
|
| 2018 | — | conf |
CIbSE
|
| 2018 | C | conf |
SEKE
|
| 2018 | — | conf |
CIbSE
|
| 2017 | — | conf |
HCI (1)
|
| 2017 | J | jnl |
CLEI Electron. J.
|
| 2017 | — | conf |
CIbSE
|
| 2016 | — | conf |
Interacción
|
| 2016 | C | conf |
SEKE
|
| 2016 | C | conf |
CLEI
|
| 2012 | J | jnl |
Inf. Softw. Technol.
|
| 2012 | A | conf |
EASE
|
| 2011 | — | conf |
CCGIDIS
|
| 2008 | — | conf |
I-USED
|
| 2008 | — | conf |
ENC
|