John U. Knickerbocker

15 papers Journal 13Unranked 2
YearRankTypeTitle / Venue / Authors
2020 J jnl
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing.
IEEE Access
Gaddi Blumrosen, Katsuyuki Sakuma, John Jeremy Rice, John U. Knickerbocker
2019 — conf
Turning the Finger into a Writing Tool.
EMBC
Katsuyuki Sakuma, Gaddi Blumrosen, John Jeremy Rice, Jeff Rogers, John U. Knickerbocker
2012 J jnl
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.
IEEE J. Solid State Circuits
Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman
2011 J jnl
Technologies for exascale systems.
IBM J. Res. Dev.
Paul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov
2008 J jnl
3D chip stacking with C4 technology.
IBM J. Res. Dev.
Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker
2008 J jnl
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.
IBM J. Res. Dev.
Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker
2008 J jnl
Preface.
IBM J. Res. Dev.
John U. Knickerbocker
2008 J jnl
Thermomechanical modeling of 3D electronic packages.
IBM J. Res. Dev.
Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker
2008 J jnl
Three-dimensional silicon integration.
IBM J. Res. Dev.
John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright
2006 J jnl
3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias.
IEEE J. Solid State Circuits
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte
2005 J jnl
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.
IBM J. Res. Dev.
John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang
2005 — conf
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.
CICC
John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes
2002 J jnl
An advanced multichip module (MCM) for high-performance UNIX servers.
IBM J. Res. Dev.
John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth
1992 J jnl
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
IBM J. Res. Dev.
Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond
1991 J jnl
IBM System/390 air-cooled alumina thermal conduction module.
IBM J. Res. Dev.
John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk