| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
Comput.
|
| 2024 | J | jnl |
Comput.
|
| 2024 | J | jnl |
IEEE Trans. Educ.
|
| 2023 | — | conf |
LATINCOM
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Symmetry
|
| 2022 | J | jnl |
Symmetry
|
| 2022 | J | jnl |
Future Gener. Comput. Syst.
|
| 2022 | J | jnl |
Symmetry
|
| 2021 | J | jnl |
Comput.
|
| 2021 | J | jnl |
Comput.
|
| 2020 | J | jnl |
IEEE Commun. Mag.
|
| 2019 | J | jnl |
A multi-item multi-packaging model to minimise cost of lost units, unpacking cost and CO2 emissions.
Int. J. Prod. Res.
|