| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Comput. Methods Programs Biomed.
|
| 2026 | J | jnl |
J. Electronic Imaging
|
| 2025 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2025 | J | jnl |
Neural Comput. Appl.
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
Skin lesion classification using modified deep and multi-directional invariant handcrafted features.
J. Netw. Comput. Appl.
|
| 2023 | J | jnl |
Digit. Signal Process.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
J. Inf. Secur. Appl.
|
| 2023 | — | conf |
ICMLDE
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
Multim. Tools Appl.
|
| 2022 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
Appl. Soft Comput.
|
| 2020 | — | conf |
CCCI
|
| 2020 | J | jnl |
Vis. Comput.
|
| 2020 | J | jnl |
IET Image Process.
|
| 2019 | J | jnl |
Multim. Tools Appl.
|
| 2018 | J | jnl |
Digit. Signal Process.
|
| 2018 | — | conf |
CVIP (2)
|
| 2018 | — | conf |
RAIT
|
| 2018 | — | conf |
ICMC
|
| 2017 | J | jnl |
Multim. Tools Appl.
|